Variable Focus Laser Patterning for Touch Sensor Conductive Films
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Solution Overview
Problem
Current methods for touch sensor patterning and printed electronics, such as photolithography and screen printing, are inefficient and costly due to multiple processing steps, expensive consumables, and toxic waste, lacking effective solutions for processing printed electronics and touch sensors.
Innovation Solution
An optical processing system with a focus-adjust optical element and actuator maintains beam focus and diameter during scanning, allowing for ablative and non-ablative processing of conductive layers and borders using a single laser scanning device, enabling efficient processing of composite films for touchscreens and other electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photolithography or screen printing is used for touch sensor patterning, then conductive layers and borders can be processed, but multiple processing steps are required and costs increase
Solution Approach 1:
The patent combines multiple processing functions (conductive layer deposition, border formation, and patterning) into a single laser processing step. The laser system simultaneously processes both the conductive layer and conductive border in one operation, eliminating the need for separate photolithography and screen printing steps, thereby reducing processing time and complexity
Solution Approach 2:
The laser processing system is designed to perform multiple functions: it can process different materials (conductive paste, nanowires, ITO), create different features (conductive layers, borders, patterns), and adjust beam parameters (diameter, focus, power) to handle various processing requirements, replacing multiple specialized processing tools
2Manufacturing precision
If conventional laser processing is used, then processing can be performed, but beam focus and diameter cannot be precisely controlled during scanning
Solution Approach 1:
The patent implements dynamic control of beam parameters during the scanning process. The beam diameter and focus position are adjusted in real-time based on the processing requirements of different features. This allows the system to maintain optimal focus and appropriate beam diameter throughout the scanning process, enabling precise processing of both fine conductive layer features and broader border structures
Solution Approach 2:
The system changes key beam parameters (diameter and focus position) dynamically during processing. By varying these parameters, the laser can selectively process different features with appropriate precision - using smaller focused beams for fine conductive layer work and larger beams for border formation, all within a single scanning operation
3Manufacturing precision
If multiple beam diameters are used for different features, then processing precision improves, but system complexity increases
Solution Approach 1:
The patent employs a dynamic beam diameter adjustment mechanism that can rapidly change the beam size during scanning. This dynamic capability allows the system to switch between different beam diameters (e.g., from large for borders to small for fine features) without requiring multiple separate processing steps or complex manual intervention, maintaining precision while managing system complexity through automated control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system reduces processing time and costs by allowing simultaneous processing of conductive layers and borders with precise control over beam diameter and focus, enhancing the efficiency and flexibility of touch sensor fabrication while minimizing environmental impact.
Implementation Method 1
an objective lens situated to direct a processing optical beam to a target surface
Implementation Method 2
ablative processing of silver paste conductive borders
Data Source
AI summary
A processing system directs a laser beam to a composite including a substrate, a conductive layer, and a conductive border. The location of a focus of the laser beam can be controlled to bring the laser beam into focus on the surfaces of the conductive materials. The laser beam can be used to ablatively process the conductive border and non-ablatively process the conductive layer by translating a focus-adjust optical system so as to vary laser beam diameter.