Variable-gap thermal interface with rotary joint
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Solution Overview
Problem
Traditional thermal-interface devices using silicone-based gap pads have low thermal conductivity and require large forces for compression, making them inefficient for heat transfer across non-uniform gaps, especially under high temperature conditions.
Innovation Solution
A variable-gap thermal-interface device utilizing a multi-axis rotary spherical joint and shims of high thermal conductivity materials to accommodate misalignment and non-uniform gaps, with optional application of thermal grease for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If silicone-based gap pads are used for thermal interface, then the device can accommodate non-uniform gaps, but thermal conductivity is low and large compressive forces are required
Solution Approach 1:
The patent changes the material parameter from silicone-based elastomer to sintered metal powder compact. This material substitution fundamentally alters thermal conductivity while maintaining gap accommodation capability through the compliant structure of the sintered metal, which can deform to fill non-uniform gaps without requiring excessive compressive force.
Solution Approach 2:
The thermal interface device uses composite material structure combining sintered metal powder compact with potentially different material properties in different regions or layers. This allows optimization of both thermal conductivity and mechanical compliance to accommodate gap variations effectively.
2Ease of operation
If silicone-based gap pads are used for thermal interface, then the device can conform to surfaces, but large forces are required for compression
Solution Approach 1:
The patent changes the mechanical parameter of the material from high-modulus silicone elastomer to sintered metal powder compact with appropriate mechanical properties. The sintered metal structure provides inherent compliance that allows surface conformity without requiring large compressive forces, as the sintered particles can rearrange and deform under lower loads.
3Device complexity
If silicone-based gap pads are used, then the device is simple in structure, but cannot withstand high temperatures
Solution Approach 1:
The patent employs sintered metal powder compact as a composite material that inherently possesses high temperature resistance due to the metal's thermal stability. This material can maintain its structural integrity and thermal conductivity properties at elevated temperatures where silicone-based materials would degrade, while still maintaining relatively simple device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher thermal conductivity and effective heat transfer across a wide range of non-uniform gap thicknesses under moderate compressive loading and high temperatures, reducing thermal resistance and operational complexity.
Implementation Method 1
a multi-axis rotary spherical joint comprising a spherically concave surface having a first radius of curvature in slideable contact with a spherically convex surface having an identical first radius of curvature
Implementation Method 2
a variable-gap thermal-interface device for transferring heat from a heat source to a heat sink
Data Source
AI summary
A method of transferring heat from a heat source to a heat sink using a variable-gap thermal-interface device is provided. The method comprises providing and rotating a multi-axis rotary spherical joint to an orientation to compensate for misalignment between the heat source and heat sink. The method further comprises providing a shim of thickness sufficient to fill a gap between the heat source and multi-axis rotary spherical joint, and inserting the shim to fill the gap.