Variable-Thickness Heat Pipe for Cold-Plate-Free Thermal Dissipation

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Solution Overview

Problem

Conventional heat pipe systems require a cold plate for enhanced thermal management, which increases the system's size and footprint, and do not efficiently manage thermal energy transfer without it.

Innovation Solution

A heat pipe with variable thickness and diameter is developed, where a thin-walled portion is connected to a thick-walled portion without a cold plate, allowing for increased thermal mass and surface area for improved heat absorption and dissipation, reducing the overall size of the system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a cold plate is used to enhance thermal management, then thermal dissipation is improved, but system size and footprint increase

Engineering Contradiction:
Improvethermal dissipationVSAvoidsystem footprint
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The patent merges the cold plate functionality directly into the heat pipe structure by creating a heat pipe with variable wall thickness. The expanded first portion with increased wall thickness performs both heat pipe function and cold plate heat spreading function, eliminating the need for a separate cold plate component and reducing overall system footprint.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat pipe features local variation in wall thickness, with a first portion having increased wall thickness compared to a second portion. This local quality change allows the thick-walled section to provide enhanced thermal mass and heat spreading capability at the heat sink interface, while maintaining a compact overall structure.

Inventive Principle:
Principle #3Local quality

2Temperature

If a cold plate is used to spread heat over larger surface area, then uniform temperature distribution is improved, but system complexity increases

Engineering Contradiction:
Improvetemperature distribution uniformityVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat pipe and cold plate into a single integrated component. The variable wall thickness design allows the heat pipe itself to perform heat spreading function, eliminating the need for separate cold plate with fins or cooling structures, thereby reducing system complexity while maintaining uniform temperature distribution.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat pipe with variable wall thickness serves multiple functions: it acts as both the heat pipe for thermal energy transport and as a cold plate for heat spreading and dissipation. This multi-functionality reduces the number of components needed and simplifies the overall thermal management system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances thermal conductivity and dissipation without the need for a cold plate, while allowing for a reduced or omitted cold plate, thereby improving thermal energy transfer and reducing the system's size and footprint.

Implementation Method 1

It relies on the principles of phase change and capillary action to achieve rapid and efficient heat transfer

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

It relies on the principles of phase change and capillary action to achieve rapid and efficient heat transfer

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 3

a thick-walled portion having a greater thermal mass, thereby providing increased heat absorption

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

This configuration enhances thermal conductivity and dissipation without the need for a cold plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250003695A1Variable heat pipe thickness and diameter for direct heat pipe attachment and improved thermal management
Publication Date: 2025.01.02 INTEL CORP
  • US20250003695A1 patent drawing
  • US20250003695A1 patent drawing
  • US20250003695A1 patent drawing

AI summary

Techniques are disclosed for manufacturing a heat pipe that includes a variable wall thickness and/or a variable diameter. The heat pipe may be formed by subjecting a pipe to a thickness processing and an expansion processing. The heat pipe may include a first portion and a second portion. The first portion may have a first diameter and a first wall thickness. The second portion may have a second diameter larger than the first diameter, and a second wall thickness larger than the first wall thickness.