Variable-Height Vibration Damping Member for Speaker-Induced Resonance
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Solution Overview
Problem
In electronic devices with sound output devices, vibrations caused by the sound output devices can lead to intensified vibrations due to variable thickness of electrical components and air spaces, resulting in poor sound quality and structural issues, as existing fixing members struggle to effectively dampen vibrations across varying thicknesses.
Innovation Solution
The implementation of a vibration damping member with a variable height and foldable structure that adapts to the thickness of the variable space between the electrical component and the back plate, dividing the space into sub-spaces to reduce vibration intensity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fixing member is disposed to correspond to a small thickness of the electrical component, then vibration of the electrical component is prevented, but the housing may inflate or apply pressure to the interior when the thickness of the electrical component is increased
Solution Approach 1:
The vibration damping member is designed with a compressible structure that can dynamically adjust its height to accommodate variations in electrical component thickness. When the component thickness increases, the member compresses to maintain contact and damping effectiveness; when thickness decreases, it expands to fill the space. This dynamic adaptation resolves the contradiction between maintaining vibration prevention and adapting to thickness variations.
Solution Approach 2:
The vibration damping member utilizes material properties that allow its height and density to change in response to compression forces. By selecting materials with appropriate compressibility parameters, the member can adapt its physical dimensions to match varying component thicknesses while maintaining effective vibration damping performance across different thickness conditions.
2Stability of the object's composition
If a fixing member is disposed to correspond to a large thickness of the electrical component, then structural stability is maintained, but a variable space is formed when the thickness of the electrical component is decreased, causing high intensity vibration
Solution Approach 1:
The vibration damping member maintains structural stability through its ability to dynamically adjust its height. When the electrical component thickness decreases, the member expands to fill the variable space, preventing the formation of air pockets that would cause high-intensity vibration. This dynamic adjustment ensures both structural stability and effective vibration control across varying thickness conditions.
Solution Approach 2:
The vibration damping member is designed with a segmented or folded structure that allows it to adapt to varying spaces. The segmentation enables the member to maintain contact with both the electrical component and the housing interior, ensuring continuous vibration damping even when the component thickness varies, thus preventing high-intensity vibration in variable spaces.
3Device complexity
If spaces in which air is present in the electronic device are connected, then the device structure is simplified, but the air may vibrate in a single mass, intensifying the vibration
Solution Approach 1:
The vibration damping member acts as a physical divider that segments the air-filled spaces within the housing. By introducing this damping member, the previously connected air space is divided into separate regions, preventing the air from vibrating as a single mass. This segmentation reduces vibration intensity while maintaining relatively simple device structure, as the damping member integrates seamlessly into the existing housing design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vibration damping member effectively reduces vibration amplitude and maintains structural integrity by adapting to thickness variations, improving sound quality and preventing structural issues within the electronic device.
Implementation Method 1
a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate
Implementation Method 2
the vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space
Data Source
AI summary
An electronic device includes a housing including a front plate forming a first surface, a back plate forming a second surface, and a side member forming a side surface surrounding a space between the first and second surfaces; a sound output device disposed in the housing; an electrical component disposed in the housing and having a variable thickness; and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate. The vibration damping member is disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component. The vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.