Variable-Height Groove Heat Sink for Uniform Semiconductor Mounting

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for mounting heat sinks on semiconductor devices with different heights require multiple types of retaining and connecting members, leading to potential mounting errors due to incorrect component choices, which can result in excessive pressure or insufficient press-fitting force, causing damage or cooling failure.

Innovation Solution

A heat sink design featuring multiple grooves at different heights on its surface allows for uniform mounting on semiconductor devices of varying heights using the same retaining and connecting members, ensuring consistent press-fitting force by matching the groove height with the device height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple types of retaining members and connecting members are used to accommodate different semiconductor device heights, then the heat sink can be mounted on devices with different heights, but the complexity of the system increases and mounting errors may occur

Engineering Contradiction:

Improveheat sink adaptability to different device heightsVSAvoidnumber of retaining member types

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The retaining member is designed with a single type that can accommodate multiple device heights through its elastic deformation capability. The connecting member includes a movable plate that can be positioned at different heights, allowing the same retaining member structure to function across various semiconductor device heights, thereby eliminating the need for multiple specialized components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The connecting member incorporates a movable plate that can be freely moved along the retaining member to different height positions. This dynamic adjustment capability allows the system to adapt to different semiconductor device heights without requiring multiple fixed-type retaining members, reducing component variety while maintaining versatility.

Inventive Principle:

Principle #15Dynamics

2Manufacturing precision

If multiple types of retaining members are used for different device heights, then proper press-fitting force can be achieved for each device type, but the risk of mounting errors increases

Engineering Contradiction:

Improvepress-fitting force uniformityVSAvoidmounting error prevention

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

Different height positions of the movable plate are marked with distinct color codes. This visual indication system guides operators to select the correct plate position for the specific semiconductor device height, preventing mounting errors while ensuring uniform press-fitting force across different device types.

Inventive Principle:

Principle #32Color changes

Solution Approach 2:

The elastic force of the retaining member provides automatic feedback adjustment. When the movable plate is positioned at the correct height for a given device, the elastic deformation of the retaining member self-adjusts to apply the appropriate press-fitting force, ensuring consistent mounting quality without requiring complex control systems.

Inventive Principle:

Principle #23Feedback

3Force

If the height of retaining members is changed to match different device heights, then uniform press-fitting force can be achieved, but the number of component types increases

Engineering Contradiction:

Improvepress-fitting force consistencyVSAvoidnumber of retaining member variants

Core Design Contradiction:

ForceVSQuantity of substance

Solution Approach 1:

The connecting member is segmented into a movable plate and a retaining member body. The movable plate can be independently positioned at different heights, allowing the same retaining member body to serve multiple device heights. This segmentation eliminates the need for multiple complete retaining member variants while maintaining force consistency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of changing the physical dimensions of the retaining member for different device heights, the system changes the position parameter of the movable plate. This parameter adjustment allows the same retaining member structure to adapt to different device heights while maintaining consistent press-fitting force characteristics.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables the same heat sinks to be mounted on semiconductor devices with different heights using the same components, preventing mounting errors and ensuring proper pressure distribution, thus avoiding damage and cooling failures while reducing component variability and costs.

Implementation Method 1

the heat sink 10 is mounted on a semiconductor device (not illustrated) by means of the elastic force of the spring-like retaining member 20

Methodology Applied

Scientific EffectElastic force: Elasticity

Data Source

PatentUS8902592B2Heat sink and method for fixing heat sink

Publication Date: 2014.12.02 FUJITSU LTD

AI summary

A heat sink for cooling a device mounted on a mount board, the heat sink having a plurality of grooves at different heights in a surface opposite a surface in contact with the device.