Variable Height Conductive Polymer Contacts for Warpage Compensation

The patent applies local quality by varying the height of individual contacts in the contact array based on their specific location. Each contact's height is optimized to compensate for local warpage and pressure distribution characteristics, ensuring uniform contact force across all contacts despite global board distortion. This is achieved by determining a height for each contact relative to a reference contact, creating a non-uniform height distribution that locally compensates for warpage effects.

The patent applies parameter changes by modifying the height parameter of contacts based on their position in the array. This height variation compensates for the non-uniform pressure distribution and warpage caused by mechanical clamping. The contact heights are adjusted to maintain optimal contact force and electrical connection despite the distorted planar shape of the assembled parts, effectively decoupling the structural clamping function from the electrical contact function.

The patent applies local quality by tailoring the height of each contact to its specific location in the high-density array. This localized optimization ensures that each contact has appropriate deflection capacity for its position, compensating for the reduced overall working range caused by increased density. The variable height design allows contacts in different regions to accommodate local warpage and pressure variations, maintaining reliable electrical connection despite the constrained deflection range inherent in high-density configurations.