Variable-Height Package Substrate Traces for Power and Signal Routing
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Solution Overview
Problem
Legacy substrate design for electronic components is limited by the need for uniform trace thickness, which compromises either power delivery or signal integrity, as thicker traces are required for power but thinner traces for impedance matching, leading to reduced signal routing density and wasted substrate space.
Innovation Solution
A package substrate design with variable height conductive elements within a single layer, utilizing a trench-filled conductive element and surface-mounted conductive elements of different thicknesses, achieved through a photo-imageable dielectric material process with controlled light exposure and etching, allowing for both power delivery and signal integrity without sacrificing space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If thicker traces are used in a single layer, then power delivery is improved with reduced voltage drop, but signal integrity deteriorates due to impedance matching issues
Solution Approach 1:
The patent applies local quality by creating variable height conductive elements within a single layer, where different regions have different trace thicknesses. Thicker traces are used in power delivery regions to reduce voltage drop, while thinner traces are used in signal routing regions to maintain impedance matching. This is achieved through selective etching processes that remove dielectric material to varying depths in different areas, allowing each local region to have the optimal trace thickness for its specific function.
2Power
If uniform thick traces are used throughout the substrate, then power delivery is improved, but signal routing density decreases due to space requirements for impedance matching
Solution Approach 1:
The invention implements local quality by spatially varying the conductive element height within the single layer. In power delivery regions, taller conductive elements provide lower resistance paths. In signal routing regions, shorter conductive elements maintain proper impedance characteristics. This local differentiation allows the substrate to simultaneously achieve effective power delivery and high signal routing density without requiring separate layers for different functions.
3Reliability
If indirect routing is used to achieve impedance matching, then signal integrity is maintained, but substrate space is wasted reducing overall density
Solution Approach 1:
The patent applies parameter changes by modifying the height parameter of conductive elements within a single layer to achieve impedance matching. Instead of using indirect routing paths that waste space, the invention directly controls the effective impedance by varying the conductive element height. This allows signal traces to follow direct paths while maintaining proper impedance characteristics, thereby improving both signal integrity and substrate space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient power delivery with reduced voltage drop and maintains signal integrity through impedance matching without the need for indirect routing, effectively utilizing substrate space for both power and signal traces.
Implementation Method 1
utilizing a trench-filled conductive element and surface-mounted conductive elements of different thicknesses, achieved through a photo-imageable dielectric material process with controlled light exposure and etching
Data Source
AI summary
Apparatuses, systems and methods associated with package substrate design with variable height conductive elements within a single layer are disclosed herein. In embodiments, a substrate may include a first layer, wherein a trench is located in the first layer, and a second layer located on a surface of the first layer. The substrate may further include a first conductive element located in a first portion of the second layer adjacent to the trench, wherein the first conductive element extends to fill the trench, and a second conductive element located in a second portion of the second layer, wherein the second conductive element is located on the surface of the first layer. Other embodiments may be described and/or claimed.