Variable Insulation Gap Wall Panel for Thermal Mode Switching

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Solution Overview

Problem

Conventional thermal insulation systems for spacecraft and aircraft struggle to effectively manage extreme temperature fluctuations, leading to challenges in maintaining interior temperature stability due to varying environmental conditions.

Innovation Solution

A system featuring a wall panel with a variable insulation gap occupied by an insulation medium, where a flow driver selectively switches the medium between conduction and insulation modes, altering thermal conductivity to regulate heat transfer, using a combination of constant gap width, fluid flow control, and phase changes to inhibit or enhance convective heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If conventional thermal insulation systems are used, then interior temperature stability is difficult to maintain under extreme temperature fluctuations, but adding active thermal management systems increases system complexity

Engineering Contradiction:
Improveinterior temperature stabilityVSAvoidsystem complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent applies dynamics by making the insulation gap width variable rather than fixed. The gap between the inner and outer walls can dynamically adjust its width in response to external temperature conditions, allowing the thermal insulation performance to adapt automatically. This dynamic adjustment mechanism enables the system to maintain interior temperature stability without requiring complex active thermal management systems, as the varying gap width passively modulates heat transfer based on environmental conditions.

Inventive Principle:
Principle #15Dynamics

2Loss of energy

If the insulation gap width is increased to improve insulation, then thermal insulation performance improves, but the system loses ability to respond to changing environmental conditions

Engineering Contradiction:
Improvethermal insulation performanceVSAvoidresponse to changing environmental conditions
Core Design Contradiction:
Loss of energyVSAdaptability or versatility

Solution Approach 1:

The patent implements dynamics by enabling the insulation gap width to vary dynamically. During extreme external temperature conditions, the gap width increases to provide enhanced thermal insulation and reduce energy loss. When environmental conditions are moderate, the gap width decreases to allow better thermal exchange. This dynamic adjustment resolves the contradiction by providing both superior insulation performance when needed and adaptability to changing conditions through automated gap width modulation.

Inventive Principle:
Principle #15Dynamics

3Device complexity

If a fixed insulation system is used, then system simplicity is maintained, but thermal management effectiveness decreases under varying temperature conditions

Engineering Contradiction:
Improvesystem simplicityVSAvoidthermal management effectiveness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent applies dynamics by transforming a fixed insulation system into a variable gap system. The distance between the inner and outer walls can change in response to temperature differentials, allowing the system to automatically optimize its insulation performance. This dynamic capability enhances thermal management effectiveness under varying temperature conditions while maintaining relative system simplicity, as the adjustment mechanism is integrated into the wall structure itself rather than requiring separate complex control systems.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for efficient heat management by varying thermal conductivity up to 200 times between modes, effectively maintaining temperature stability and enabling cyclic heat exchange to accommodate changing environmental conditions, thereby enhancing thermal regulation and system performance.

Implementation Method 1

The insulation medium has a first effective thermal conductivity in the insulation mode, and a second effective thermal conductivity in the conduction mode

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

drive fluid through the gap in the conduction mode to cause convective heat transfer across the variable insulation gap by forced convection

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 3

in the insulation mode, the gap is too narrow for natural convection currents to form turbulent flows in the gap

Methodology Applied
Scientific EffectNatural convection suppression: Free Convection

Implementation Method 4

The driver is configured to change pressure and/or density of the insulation medium in switching between the insulation mode and the conduction mode

Methodology Applied
Scientific EffectPressure change: Pressure Increase

Data Source

PatentEP4417525A1Variable thermal insulation
Publication Date: 2024.08.21 COLLINS ENGINE NOZZLES INC
  • EP4417525A1 patent drawingFigure 1
  • EP4417525A1 patent drawingFigure 2~4
  • EP4417525A1 patent drawingFigure 5

AI summary

A system includes a wall panel (102) with an exterior wall (104). An interior wall (106) is separated from the interior wall by a variable insulation gap (108) occupied by an insulation medium. A flow driver (110) is connected in fluid communication with the insulation medium. The flow driver is configured to selectively switch properties of the insulation medium in the variable insulation gap between a conduction mode and in an insulation mode. The insulation medium has a first effective thermal conductivity in the insulation mode, and a second effective thermal conductivity in the conduction mode. The first effective thermal conductively is lower than the second effective thermal conductivity.