Variable-Length Pusher for Warped Semiconductor Testing

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Solution Overview

Problem

Semiconductor devices, particularly integrated circuits, face challenges during final testing post-packaging due to warping, which complicates electrical contact and accurate damage identification, as existing testing apparatuses struggle to accommodate varying device shapes and heights effectively.

Innovation Solution

A testing apparatus featuring a variable-length pusher system with a telescopic mechanism and elastic members, controlled by an actuator, allows for individual zonal contact and force distribution across different heights of the device, ensuring consistent electrical contact despite warping, using a DUT block, probes, and an actuator to manage the pushers' movement and compression.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a fixed-length pusher system is used, then the structure is simple, but it cannot accommodate warped devices with varying shapes and heights

Engineering Contradiction:

Improveaccommodation of warped devicesVSAvoidpusher system structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The pusher system transitions from a fixed-length structure to a variable-length telescopic mechanism that can dynamically adjust its length. Each pusher comprises a pusher body and a pusher rod that can extend and retract, allowing the system to adapt to devices with varying heights and warping conditions during final testing

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The pusher system is divided into multiple independent telescopic units, each capable of independent extension and retraction. This segmentation allows each pusher to independently adjust to contact specific zones of warped devices, providing zone-specific adaptation while maintaining overall system simplicity

Inventive Principle:

Principle #1Segmentation

2Reliability

If individual zonal contact is implemented, then electrical contact reliability is improved, but the control complexity increases

Engineering Contradiction:

Improveelectrical contact reliabilityVSAvoidcontrol system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each telescopic pusher is designed with identical structure but can be positioned to contact different zones of the device under test. The local quality is achieved through the ability of each pusher to independently adjust its length and position, allowing tailored contact for each specific zone regardless of device warping

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables reliable electrical contact and effective final testing of semiconductor devices by accommodating warped devices, ensuring accurate identification of damage and improved testing efficiency through adjustable pusher lengths and force distribution.

Implementation Method 1

an elastic member coupled to the pusher rod and the pusher body, respectively

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS9285394B2Testing apparatus and method

Publication Date: 2016.03.15 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A test apparatus includes a DUT block, at least one probe and at least one variable-length pusher. The DUT block is used for allowing the DUT to be disposed thereon. The probe is located on the DUT block. The variable-length pusher is located above the probe. The actuator is used for moving the variable-length pusher to push against the DUT to force the DUT to be in electrical contact with the probe.