Variable Loop Recipe Control for Uniform Layer Deposition

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional substrate processing methods require multiple separate recipes to maintain uniform layer thickness, leading to increased energy consumption, processor overhead, and substrate damage due to the need for repeated execution of different recipes for each loop iteration.

Innovation Solution

A variable loop control feature that uses a single recipe with iteration adjustments and multipliers to achieve uniform layer thickness, reducing the need for multiple separate recipes by generating an offset table to adjust manufacturing parameters across iterations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but energy consumption increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidenergy consumption
Core Design Contradiction:
Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The patent combines multiple separate recipes into a single unified recipe that uses iteration adjustments and multipliers to achieve the same layer uniformity. Instead of executing multiple distinct recipes, the system executes one recipe with dynamic parameter modifications across iterations, merging the functionality of multiple recipes into one while reducing energy consumption.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs parameter changes through iteration adjustments and multipliers that modify process parameters dynamically during recipe execution. Each iteration applies calculated adjustments to parameters such as deposition time, temperature, or flow rates based on feedback from previous iterations, enabling uniform layer thickness without requiring multiple separate recipes.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but processor overhead increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidprocessor overhead
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple recipe execution contexts into a single recipe execution with iteration-based parameter modification. The processor manages one recipe loop instead of switching between multiple recipes, reducing context switching overhead and simplifying the control logic while maintaining the ability to adjust parameters for uniformity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces dynamic parameter adjustment within a single recipe through iteration adjustments and multipliers. Instead of static multiple recipes, the system dynamically modifies parameters during execution based on iteration number and feedback, reducing the need for multiple pre-configured recipes and lowering processor overhead for recipe management.

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but substrate damage increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidsubstrate damage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent combines multiple recipe executions into a single continuous execution with iteration adjustments. This reduces the number of times substrates must be loaded, unloaded, and re-positioned between recipe executions, thereby reducing mechanical handling damage while maintaining layer uniformity through parameter adjustments within the single recipe loop.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent enables continuous processing within a single recipe execution rather than interrupting for multiple separate recipe loads. The iteration-based parameter adjustment allows the process to continue uninterrupted with dynamic modifications, reducing substrate handling cycles and associated damage risks while maintaining uniformity.

Inventive Principle:
Principle #20Continuity of useful action

4Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but bandwidth usage increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidbandwidth usage
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The patent merges multiple recipe data structures into a single recipe with iteration-based parameters. This reduces the bandwidth required to transfer and store recipe data, as well as the communication overhead between control systems, while maintaining uniformity through dynamic parameter adjustment during execution rather than through multiple separate recipe definitions.

Inventive Principle:
Principle #5Merging (Combining)

5Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but personnel time increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidpersonnel time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent combines multiple separate recipe creation, validation, and maintenance tasks into a single recipe framework with automatic iteration adjustments. This reduces personnel time required for recipe management, as the system automatically calculates and applies parameter adjustments across iterations rather than requiring manual creation and coordination of multiple separate recipes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements self-service through automatic iteration adjustments and multipliers that the system calculates and applies without manual intervention. The system autonomously modifies parameters across iterations based on feedback and predefined algorithms, reducing personnel time for recipe tuning and maintenance while maintaining layer uniformity.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces energy consumption, bandwidth usage, and personnel time while improving substrate uniformity and reducing damage to both substrates and processing systems by allowing a single recipe to be used across multiple iterations with adjusted parameters.

Implementation Method 1

A variable loop control feature for substrate processing... identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

A variable loop control feature for substrate processing... identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Data Source

PatentUS11841692B2Variable loop control feature
Publication Date: 2023.12.12 APPLIED MATERIALS INC
  • US11841692B2 patent drawing
  • US11841692B2 patent drawing
  • US11841692B2 patent drawing

AI summary

A method includes identifying a recipe for depositing layers on a substrate in a processing chamber of a substrate processing system. The recipe comprises iterations of a set of one or more processes, and wherein each iteration of the iterations is for depositing at least one layer of the layers. The method further includes determining changes to parameters for depositing the at least one layer on the substrate. Each of the changes corresponds to a respective iteration of the iterations and is associated with a relative position of a corresponding layer. The layers are to be deposited on one or more substrates based on the recipe and the changes.