Variable Matching Circuit for RF Component Packages
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Solution Overview
Problem
Existing component packages with matching circuits require detailed and precise designing, making it difficult to configure and optimize matching characteristics, especially when different components are inserted, as accurate calculations and re-designs are necessary for desirable performance.
Innovation Solution
A component package with a matching unit featuring a substrate, transmission line, bonding wire, and capacitor units where inductance is adjusted by varying the bonding wire length and capacitance by adding or removing capacitors, allowing for flexible configuration and optimization without prior detailed design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If detailed and precise designing is performed based on large signal modeling and small signal modeling, then matching characteristics can be optimized, but the design process becomes very difficult and time-consuming
Solution Approach 1:
The patent applies parameter changes by providing a set of capacitor units with different capacitance values that can be selectively connected to the transmission line. Instead of performing complex modeling and calculations to determine optimal capacitance values, the designer can simply select and connect appropriate capacitor units to achieve the desired matching characteristics. This transforms a complex design problem into a simple parameter selection task.
2Manufacturing precision
If accurate calculation of impedance transformer is performed beforehand, then desirable matching characteristics can be achieved, but the design process becomes difficult without accurate calculation
Solution Approach 1:
The patent provides multiple capacitor units with different capacitance values (e.g., different combinations of series and parallel connected capacitors) that can be selectively connected to the transmission line. This allows the impedance transformation ratio to be adjusted by simply changing which capacitor units are connected, eliminating the need for accurate beforehand calculation of the impedance transformer.
Solution Approach 2:
The patent makes the matching circuit dynamically adjustable by providing the ability to selectively connect different capacitor units to the transmission line. This dynamic configuration allows the circuit to be adapted to different impedance matching requirements without requiring complex beforehand calculations, as the appropriate capacitance can be selected and connected as needed.
3Manufacturing precision
If matching circuit is designed for a specific power component, then matching characteristics can be optimized, but re-design is required when different power components are used
Solution Approach 1:
The patent makes the matching circuit universal and adaptable to different power components by providing multiple capacitor units with different capacitance values that can be selectively connected. This allows the same matching circuit structure to be used with different power components (e.g., different MOSFETs or GaN FETs) by simply selecting and connecting the appropriate capacitor units, eliminating the need for complete re-design when components are changed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy configuration and optimization of matching circuits, allowing for adjustments in capacitance and inductance values, even with different components, simplifying the process and improving matching characteristics without the need for precise initial design or re-design.
Implementation Method 1
an inductance of the matching unit is variable by adjusting a length of the bonding wire
Implementation Method 2
a capacitance of the matching unit is variable by increasing or reducing the number of capacitors electrically connected to the transmission line
Data Source
AI summary
Provided herein is a component package including a matching unit and a matching method thereof, the matching unit including: a substrate; a transmission line formed on the substrate, the transmission line being connected to a terminal of the component package; a bonding wire electrically connecting the transmission line and a central component; and a capacitor unit having a plurality of capacitors electrically connected with the transmission line by wiring connection, wherein an inductance of the matching unit is variable by adjusting a length of the bonding wire, and a capacitance of the matching unit is variable by increasing or reducing the number of capacitors electrically connected to the transmission line, of among the capacitors inside the capacitor unit, by extending or cutting off the wiring connection.