Variable-Height Interposer Pillars for Warp-Compensated Packaging

Solution Overview

Problem

Semiconductor packages face challenges in maintaining mechanical integrity and reliable electrical connections due to warping of the interposer and package substrate, leading to increased instances of solder cold joints and potential cracking.

Innovation Solution

The implementation of semiconductor packages with pillars of varying heights on the interposer surface to compensate for warping, ensuring uniform gaps and improved electrical connections by adjusting pillar heights in different regions to accommodate deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If uniform pillar heights are used on the interposer surface, then the manufacturing process is simple, but warping causes non-uniform gaps leading to solder cold joints and cracking

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidpillar structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by varying the pillar heights at different locations on the interposer surface. Specifically, pillars in the first region have a first height while pillars in the second region have a second height that is greater than the first height. This local variation compensates for the non-uniform warping of the interposer, maintaining uniform gaps between the pillars and the circuit board surface, thereby preventing solder cold joints and cracking while improving electrical connection reliability.

Inventive Principle:

Principle #3Local quality

2Reliability

If pillar heights are varied to compensate for warping, then uniform gaps and connection reliability are improved, but the manufacturing process becomes more complex

Engineering Contradiction:

Improvesolder joint reliabilityVSAvoidpillar formation process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by dividing the interposer surface into multiple regions (first region and second region) with different pillar height specifications. This segmentation allows the manufacturing process to be broken down into discrete steps: forming pillars in the first region to a first height, then forming pillars in the second region to a greater second height. This segmented approach makes the complex variable height fabrication more manageable and manufacturable compared to attempting to create all pillars in a single uniform step.

Inventive Principle:

Principle #1Segmentation

3Productivity

If the interposer is made larger to accommodate more components, then component integration increases, but warping effects are amplified causing more severe mechanical integrity issues

Engineering Contradiction:

Improvecomponent integration densityVSAvoidmechanical integrity

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The patent applies local quality by varying the pillar heights at different locations on the interposer surface. Specifically, pillars in the first region have a first height while pillars in the second region have a second height that is greater than the first height. This local variation compensates for the non-uniform warping of the interposer, maintaining uniform gaps between the pillars and the circuit board surface, thereby preventing solder cold joints and cracking while improving electrical connection reliability.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250357302A1Method for forming semiconductor package with variable pillar height

Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Semiconductor packages and methods of fabricating semiconductor packages include bonding structures on a surface of an interposer having non-uniform height dimensions in different regions of the interposer. A plurality of solder connections may contact the pillars and electrically connect the respective pillars of the interposer to corresponding bonding structures on a package substrate. The variation in the heights of the pillars in different regions of the interposer may compensate for warping of the interposer and improve the reliability of the electrical connections between the interposer and the package substrate.