Variable Pin Fin Cold Plate for Varying Heat Sources
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in efficiently managing heat dissipation, particularly in accommodating varying heat source configurations and maintaining thermal performance while allowing for fluid flow and flexibility.
Innovation Solution
The development of heat sink sheets with varying density and configuration pin portions and links, which are stacked and bonded to form pin fins, allowing for flexible and customizable heat dissipation by creating active regions with different thermal performance areas and a conformable layer for accommodating dimensional differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform pin fin density is used across the heat sink, then manufacturing is simplified, but thermal performance cannot be optimized for varying heat source configurations
Solution Approach 1:
The heat sink is divided into multiple heat sink sheets, each with distinct pin fin density regions. This segmentation allows different areas to be optimized for specific thermal requirements while maintaining manufacturability through modular construction.
Solution Approach 2:
Different regions of the heat sink are designed with locally optimized pin fin densities - higher density in areas requiring greater heat dissipation and lower density in areas with reduced thermal demands. This local quality approach optimizes thermal performance for varying heat source configurations.
2Strength
If rigid heat sink structure is used, then structural strength is improved, but adaptability to different heat source configurations is reduced
Solution Approach 1:
The heat sink incorporates a compliant layer that enables dynamic adaptation to different heat source configurations. This layer allows the rigid pin fin structures to conform to varying surfaces while maintaining overall structural integrity and strength.
Solution Approach 2:
A flexible compliant layer is integrated into the heat sink structure, allowing the rigid pin fin assemblies to adapt to non-flat surfaces and different heat source geometries while preserving structural strength through the layered construction.
3Power
If high pin fin density is used throughout, then heat dissipation capacity is improved, but fluid flow resistance increases
Solution Approach 1:
High pin fin density is applied locally in regions requiring maximum heat dissipation, while lower density regions are positioned where fluid flow is prioritized. This local differentiation optimizes the balance between heat dissipation capacity and fluid flow resistance.
Solution Approach 2:
Instead of uniformly high pin fin density throughout, the design applies high density partially in specific high-heat regions, achieving sufficient heat dissipation capacity while reducing overall fluid flow resistance compared to a fully dense configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation efficiency by allowing for flexible fitment with different heat sources, maintaining thermal performance, and reducing pressure drops across the cold plate, while accommodating non-flat surfaces and varying heat source configurations.
Implementation Method 1
a first plurality of pin portions of a first layer can be configured according to a first configuration, and a second plurality of pin portions of a second layer can be configured according to a second configuration
Implementation Method 2
a conformable layer adjacent to at least one of the plurality of layers
Data Source
AI summary
A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.