Variable Resistance Memory Stabilization Method

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Solution Overview

Problem

Nonvolatile variable resistance memory devices with oxygen-deficient oxide layers face issues where the memory cells may not reach a sufficient low resistance state, leading to a 'half LR state' that reduces the resistance change window, affecting reading speed and reliability.

Innovation Solution

A method involving a three-step voltage application process: high resistance writing, low resistance writing, and low resistance stabilization writing, where a positive voltage is applied after a negative voltage to ensure the memory cell reaches a stable low resistance state, preventing the half LR state.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a negative voltage is applied to write low resistance state, then the memory cell resistance decreases, but the memory cell may not reach a sufficient low resistance state and remains in a half LR state

Engineering Contradiction:
Improveresistance state precisionVSAvoidreading reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

A forming process is performed before normal write operations to initialize the oxygen-deficient oxide layer. This preliminary action creates the proper initial state that enables subsequent write operations to reliably achieve the low resistance state without remaining in a half LR state.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies different voltage parameters at different stages: a forming voltage to initialize the layer, then specific write voltages for high and low resistance states. By carefully controlling voltage magnitude and polarity, the memory cell reliably transitions between states without getting stuck in an intermediate half LR state.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If oxygen-deficient oxide layer is used, then nonvolatile memory characteristics are improved, but the memory cell may not reach a sufficient low resistance state

Engineering Contradiction:
Improvenonvolatile memory characteristicsVSAvoidresistance state precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The forming process is a preliminary action that specifically addresses the characteristics of oxygen-deficient oxide layers. It initializes the layer in a state that enables reliable switching between high and low resistance states, overcoming the inherent tendency to remain in a half LR state during normal operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Different voltage parameters are used for forming versus normal write operations. The forming voltage is specifically tailored to initialize the oxygen-deficient oxide layer properly, while subsequent write operations use optimized voltage parameters that work effectively with the pre-initialized layer, ensuring precise resistance state transitions.

Inventive Principle:
Principle #35Parameter changes

3Device complexity

If simple two-step voltage application is used, then writing process is simplified, but reading speed and reliability are reduced due to half LR state

Engineering Contradiction:
Improvewriting process complexityVSAvoidreading speed
Core Design Contradiction:
Device complexityVSSpeed

Solution Approach 1:

The forming process is a one-time preliminary action performed during initialization or first use. It sets up the oxygen-deficient oxide layer for reliable operation, after which normal two-step write operations can proceed efficiently without repeatedly encountering half LR state problems, thus improving reading speed and reliability without significantly increasing ongoing complexity.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach stabilizes the low resistance state, ensuring a maximum resistance change window and improving reading speed and memory device reliability by preventing the occurrence of the half LR state.

Implementation Method 1

The variable resistance element is such an element that has at least two threshold voltages (a threshold voltage for writing and a threshold voltage for erasing), reversibly changes in resistance value by an electrical signal exceeding the writing or erasing threshold voltage

Methodology Applied
Scientific EffectElectroresistive effect: Electrical Resistance

Data Source

PatentUS8665633B2Nonvolatile variable resistance memory element writing method, and nonvolatile variable resistance memory device
Publication Date: 2014.03.04 PANASONIC SEMICON SOLUTIONS CO LTD
  • US8665633B2 patent drawing
  • US8665633B2 patent drawing
  • US8665633B2 patent drawing

AI summary

A method of writing data to a variable resistance element (10a) that reversibly changes between a high resistance state and a low resistance state according to a polarity of an applied voltage, as a voltage applied to an upper electrode (11) with respect to a lower electrode (14t): a positive voltage is applied in a high resistance writing step (405) to set the variable resistance element to a high resistance state (401); a negative voltage is applied in a low resistance writing step (406, 408) to set the variable resistance element to a low resistance state (403, 402); and a positive voltage is applied in a low resistance stabilization writing step (404) after the negative voltage is applied in the low resistance writing step, thereby setting the variable resistance element through the low resistance state to the high resistance state.