Variable-Resistance Thermal Interface for Rapid DUT Temperature Cycling
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Solution Overview
Problem
Existing thermal control systems for integrated circuit (IC) devices face challenges in rapidly maintaining a desired silicon junction temperature setpoint due to high thermal impedance of thermal masses in contact with the device under test (DUT), which limits testing throughput and efficiency.
Innovation Solution
The implementation of a Variable-Resistance Thermal Interface (VRTI) that regulates thermal resistance between a heat source and a heat sink, allowing for rapid thermal response through a deformable thermal interface, heat pipes, movable bridge fins, and rotatable orthotropic cylinders, enabling near-instantaneous thermal coupling and decoupling without physical displacement, thus mitigating heating and cooling latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If large thermal masses are used for thermal control, then thermal stability is improved, but thermal response speed deteriorates due to high thermal impedance
Solution Approach 1:
The thermal control system is segmented into multiple independent thermal zones with separate heating and cooling elements. Each zone can be controlled independently, allowing rapid local thermal adjustments without requiring large thermal masses to be heated or cooled globally, thus improving thermal response speed while maintaining stability in each zone.
Solution Approach 2:
The patent implements dynamic thermal control by using variable thermal conductance interfaces that can rapidly switch between thermal coupling and decoupling states. This allows the system to adapt thermal response characteristics in real-time, enabling fast thermal transitions when needed while maintaining stability during steady-state operation.
2Productivity
If rapid heating and cooling is implemented, then testing throughput is improved, but thermal control precision deteriorates
Solution Approach 1:
The patent incorporates feedback control mechanisms with temperature sensors and control algorithms that continuously monitor thermal conditions and adjust heating/cooling power in real-time. This feedback loop maintains thermal control precision even during rapid temperature transitions, enabling fast cycling without sacrificing accuracy in reaching and maintaining target temperatures.
Solution Approach 2:
The system dynamically changes thermal parameters such as heating power, cooling flow rate, and thermal conductance to optimize both speed and precision. By adjusting these parameters adaptively during the thermal cycling process, the system achieves rapid temperature changes when far from the target while maintaining precision control when approaching the setpoint.
3Reliability
If traditional thermal coupling mechanisms are used, then thermal contact is reliable, but mechanical wear and damage occur due to physical displacement
Solution Approach 1:
The patent replaces traditional mechanical thermal coupling mechanisms (such as sliding contacts or pressurized interfaces) with solid-state thermal switches or shape memory alloy-based coupling mechanisms. These eliminate relative physical displacement between thermal contact surfaces, preventing mechanical wear while maintaining reliable thermal contact when coupled, thus extending component lifespan without sacrificing thermal contact reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The VRTI enables rapid and efficient temperature cycling of DUTs by varying thermal resistance, allowing for rapid heating and cooling, thereby enhancing testing throughput and reducing thermal latency, while avoiding wear and damage associated with traditional large thermal masses.
Implementation Method 1
a variable-resistance thermal interface (VRTI) structure between the first and second thermal contact plates
Implementation Method 2
heat pipes
Implementation Method 3
heat pipes
Implementation Method 4
movable bridge fins
Implementation Method 5
rotatable orthotropic cylinders
Data Source
AI summary
An apparatus for testing integrated circuits (ICs) , includes a first thermal contact structure having a first surface to interface with a heat source and an opposing second surface to interface with a device under test (DUT). A second thermal contact structure is above the first thermal contact structure and separated therefrom by a variable-resistance thermal interface (VRTI) structure operable to couple or decouple the first and second thermal contact structures from one another. The VRTI structure has a maximal thermal conductivity associated with a first state, and a minimal thermal conductivity associated with a second state.