Variable Spacing Radiation Fins for Uniform Semiconductor Chip Cooling
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Solution Overview
Problem
In liquid-cooling-type cooling apparatuses for semiconductor chips in electric vehicle control systems, temperature differences between chips lead to reduced output currents due to uneven coolant temperatures, necessitating complex port configurations and high pressure to maintain sufficient coolant flow.
Innovation Solution
The cooling apparatus features radiation fins with varying cooling efficiencies along the coolant flow direction, with lower efficiency near the inflow port and higher efficiency near the outflow port, reducing temperature differences between semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If semiconductor chips are arranged along the coolant flow direction in a liquid-cooling-type cooling apparatus, then heat dissipation efficiency is improved, but temperature differences between chips increase causing output current limitations
Solution Approach 1:
The patent applies local quality by varying the spacing between radiation fins along the coolant flow direction. Specifically, the spacing is made smaller in the downstream region (near outflow port) and larger in the upstream region (near inflow port). This creates different heat transfer characteristics at different locations, compensating for the temperature gradient in the coolant and achieving uniform chip temperatures throughout the array.
2Temperature
If multiple inflow ports and outflow ports are disposed to eliminate temperature differences, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
Instead of adding multiple ports, the patent modifies the local geometry of the radiation fins by varying their spacing along the flow direction. This single-port configuration with variable fin spacing achieves temperature uniformity through localized structural adjustments rather than system-level complexity.
3Quantity of substance
If high coolant pressure is applied to produce sufficient coolant flow, then coolant flow rate is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent optimizes the local flow characteristics by adjusting radiation fin spacing, creating regions of different flow resistance along the coolant path. This passive flow distribution method achieves sufficient coolant flow and heat transfer without requiring complex active pressurization systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform working temperatures for all semiconductor chips, preventing derating and enabling higher chip output without the need for multiple ports, thus simplifying the structure and reducing manufacturing costs.
Implementation Method 1
the heat energy generated from the semiconductor chips is transferred efficiently to the coolant via the radiation fins having large surface areas
Implementation Method 2
causing a pressurized coolant to flow in the duct, the heat energy generated from the semiconductor chips is transferred efficiently to the coolant via the radiation fins
Implementation Method 3
the heat energy generated from the semiconductor chips is transferred efficiently to the coolant via the radiation fins
Data Source
AI summary
A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sheet-shaped fins having different lengths are arranged such that the surface area density of the fins becomes higher in the coolant flow direction, whereby the surface area density is the total surface area of radiation fins on a unit surface area of the metal base. As a result, the temperatures of semiconductor chips arranged along the coolant flow direction are closer to each other.