Variable Suction Imprint Substrate Holding for Distortion Control
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Solution Overview
Problem
In multi-field dispensing for semiconductor device manufacturing, the reduction of holding force to release distortion in substrates leads to productivity deterioration due to the time required for distortion release, affecting the accuracy and throughput of pattern formation.
Innovation Solution
A pattern forming method using a substrate holding unit that adjusts holding forces for different regions, allowing for sequential coating and pattern formation on grouped shot regions with reduced suction force for distortion release and increased force for pattern accuracy, enabling efficient distortion release without positional deviation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the holding force is reduced to release distortion in substrates, then the accuracy of pattern formation is improved, but the productivity deteriorates due to the time required for distortion release
Solution Approach 1:
The substrate surface is divided into multiple holding regions with different holding forces. The substrate holding unit applies a first holding force to a first holding region and a second holding force to a second holding region, where the first holding force is smaller than the second holding force. This segmentation allows distortion release in specific regions without compromising overall substrate stability, thereby maintaining both pattern formation accuracy and productivity.
Solution Approach 2:
Different holding forces are applied to different regions of the substrate based on local requirements. The substrate holding unit is configured to provide varying holding forces across different holding regions, enabling localized distortion release where needed while maintaining stronger holding in other regions to prevent positional deviation and maintain productivity.
2Manufacturing precision
If the holding force is reduced for distortion release, then the distortion is released, but the time required for force reduction causes productivity deterioration
Solution Approach 1:
The substrate holding unit is pre-configured with multiple holding regions that can independently adjust holding forces. Before pattern formation, the system can pre-release distortion in specific regions by applying reduced holding forces only where needed, rather than reducing holding force across the entire substrate. This preliminary and localized action minimizes the time required for distortion release while maintaining overall substrate stability.
3Productivity
If multi-field dispensing is used to improve throughput, then the productivity increases, but the distortion release requirement between shot regions causes time loss
Solution Approach 1:
The substrate is divided into multiple holding regions corresponding to different shot regions. Each holding region can independently control holding force, allowing the system to maintain high holding forces in regions not currently being processed while reducing holding forces only in the active shot region. This enables continuous multi-field dispensing without requiring repeated full-substrate distortion release, thereby maintaining high throughput.
Solution Approach 2:
The substrate holding unit dynamically adjusts holding forces in different regions during the multi-field dispensing process. As the mold moves between shot regions, the holding force is dynamically reduced in the current shot region to release distortion and maintained or increased in other regions. This dynamic adjustment allows continuous processing without interruption for distortion release, preserving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the accuracy of pattern formation while maintaining high throughput by strategically managing suction forces to minimize distortion and positional errors during the pattern formation process.
Implementation Method 1
a substrate holding unit capable of changing a holding force for each holding region
Data Source
AI summary
A pattern forming method of forming, with a mold, a pattern on a substrate held by a substrate holding unit capable of changing a holding force for each holding region includes setting, with a plurality of shot regions corresponding to a first holding region as a target for pattern formation, a first holding force in the first holding region smaller than a second holding force in a second holding region different from the first holding region, coating, with an imprint material, a region including the plurality of shot regions corresponding to the first holding region, and forming the pattern on the substrate by bringing the imprint material, with which the plurality of shot regions corresponding to the first holding region is coated, and the mold in contact with each other.