Variable Temperature Control for Metal-Oxide E-Beam Evaporation

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Solution Overview

Problem

The use of ZnO powder as a deposition raw material in electron-beam evaporation technology is not suitable for large-sized substrates due to insufficient thin film uniformity and thermal stress-induced cracks caused by temperature differences between scanned and unscaled regions, leading to reduced productivity.

Innovation Solution

A metal-oxide electron-beam evaporation source with a variable temperature control device, featuring multiple heating units and a control unit that maintains a temperature difference of 300°C or less between regions, reducing thermal stress and preventing cracks by dynamically adjusting the temperature based on the changing shape of the deposition material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electron beam is scanned on metal oxide target to improve deposition speed and efficiency, then deposition efficiency is improved, but thermal stress causes cracks due to temperature difference between scanned and non-scanned regions

Engineering Contradiction:
Improvedeposition efficiencyVSAvoidcrack prevention
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The heating system is divided into multiple independent heating zones (first heating zone, second heating zone, third heating zone) that can be controlled separately. This segmentation allows differential temperature control across the target surface, enabling the scanned region to be heated to a higher temperature for efficient evaporation while the non-scanned regions are maintained at lower temperatures to prevent excessive thermal stress and crack formation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the metal oxide target are assigned different temperature characteristics. The scanned region receives higher temperature for efficient material evaporation, while non-scanned regions are maintained at lower temperatures. This local quality differentiation resolves the contradiction by optimizing deposition efficiency in the scanned zone while preventing thermal stress-induced cracks in the non-scanned zones.

Inventive Principle:
Principle #3Local quality

2Reliability

If multiple heating zones are introduced to control temperature distribution, then thermal stress is reduced, but device complexity increases

Engineering Contradiction:
Improvecrack preventionVSAvoidheating system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The heating system is divided into multiple independent heating zones (first heating zone, second heating zone, third heating zone) that can be controlled separately. This segmentation allows differential temperature control across the target surface, enabling the scanned region to be heated to a higher temperature for efficient evaporation while the non-scanned regions are maintained at lower temperatures to prevent excessive thermal stress and crack formation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A temperature detection device continuously monitors the temperature distribution across different zones of the metal oxide target and provides feedback to the control unit. The control unit adjusts the power supplied to each heating zone based on this feedback, maintaining optimal temperature differences that prevent crack formation while enabling efficient deposition. This closed-loop control system manages the complexity of multiple heating zones through intelligent regulation.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures uniform deposition on large-sized substrates by minimizing thermal stress, thereby enhancing material efficiency and preventing cracks, thus improving the overall thin film deposition process.

Implementation Method 1

an electron beam is directly scanned over the deposition material

Methodology Applied
Scientific EffectElectron beam heating: Electron Beam

Implementation Method 2

heat or an electron beam is focused on a metal-oxide target for evaporation

Methodology Applied
Scientific EffectThermal evaporation: Evaporation

Implementation Method 3

N heating units provided in an outer portion of the crucible, dividing the crucible into N regions

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 4

causing a phase transition of the raw material into a gaseous state and depositing the raw material onto a substrate

Methodology Applied
Scientific EffectPhase transition: Phase Change

Data Source

PatentUS11692260B2Metal-oxide semiconductor evaporation source equipped with variable temperature control module
Publication Date: 2023.07.04 T O S
  • US11692260B2 patent drawing
  • US11692260B2 patent drawing
  • US11692260B2 patent drawing

AI summary

A metal-oxide electron-beam evaporation source including a variable temperature control device according to the present invention includes: a crucible configured to store a deposition material which is formed of a metal oxide and over which an electron beam is directly scanned; N heating units provided in an outer portion of the crucible, dividing the crucible into N regions, and provided for N regions, respectively; and a control unit configured to control the N heating units so that a temperature of an upper region of the crucible is maintained to be higher than that of a lower region of the crucible to reduce a temperature difference between a region over which the electron beam is scanned and a region over which the electron beam is not scanned.