Variable temperature analytical instrument assemblies, components, and methods for providing variable temperatures
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing variable temperature analytical instrumentation requires lengthy times to change temperatures, particularly for low Kelvin analyses, leading to prolonged analysis and result delivery times.
Innovation Solution
The development of variable temperature analytical assemblies that include a first mass configurable for variable temperatures and a second mass movable between thermally engaged and disengaged positions, utilizing low thermal conductance components and thermally insulated members to facilitate rapid temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If traditional thermal connection methods are used to maintain sample temperature, then thermal stability is improved, but temperature change speed deteriorates
Solution Approach 1:
The patent implements a movable thermal connection mechanism where the thermal link between the cold source and sample holder can be dynamically adjusted between engaged and disengaged states. This dynamic structure allows the system to switch between thermal stability (when engaged) and rapid temperature change (when disengaged), resolving the contradiction between these two requirements.
Solution Approach 2:
The thermal connection system is segmented into separate components: a cold source, a movable thermal link, and a sample holder. This segmentation allows independent control of thermal engagement, enabling rapid temperature changes by disconnecting the thermal path while maintaining thermal stability when connected, thus resolving the contradiction.
2Measurement precision
If thermal connection is maintained for sample analysis, then analysis accuracy is improved, but analysis time deteriorates
Solution Approach 1:
The movable thermal connection allows the system to be dynamically configured: connected during analysis for accuracy, and disconnected when temperature changes are needed. This dynamic control enables rapid temperature switching without compromising analysis accuracy, resolving the time-accuracy tradeoff.
Solution Approach 2:
The system prepares the sample at the desired temperature using the movable thermal connection before analysis begins. By pre-cooling or pre-heating the sample holder and sample, the system ensures the sample is ready for immediate analysis at the correct temperature, reducing overall analysis time while maintaining accuracy.
3Manufacturing precision
If thermal insulation is used to reduce heat transfer, then temperature control precision is improved, but thermal engagement time deteriorates
Solution Approach 1:
The system separates the thermal insulation function (permanent thermal barriers) from the thermal engagement function (movable connection). The movable connection allows rapid thermal engagement when needed, while insulation materials provide precision temperature control during engagement, resolving the contradiction between engagement speed and temperature control precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid temperature adjustments and efficient sample analysis, reducing the time required for temperature changes and enhancing the speed of analytical results, especially for low Kelvin analyses.
Implementation Method 1
thermally insulated members coupled to the mass and thermally insulating the mass from the cold source
Implementation Method 2
a second mass moveable between a first position and a second position. The first position can be thermally disengaged from the first mass and the second position can be thermally engaged to the first mass
Data Source
AI summary
Variable temperature analytical assemblies are provided and/or methods for changing temperatures of a mass are provided. Low thermal conductance components and/or assemblies are also provided. Methods for thermally isolating a mass from a support structure are also provided.


