Variable Thermal Conductivity Film for Curved Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat dissipation adjustment structures lack sufficient adhesion to objects and are not suitable for complex shapes, such as curved surfaces, due to poor shape processability.
Innovation Solution
A composition comprising a binder and a variable thermal conductivity material, with a specific thermal conductivity ratio, along with an inorganic compound and solvent, is used to create a film that adheres well to objects and can be applied to complex shapes, including curved surfaces, by crosslinking and curing the composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation adjustment structure uses a material whose thermal resistance changes with temperature, then thermal energy control is improved, but adhesion to the object is insufficient and shape processability deteriorates
Solution Approach 1:
The patent uses a composite material system consisting of variable thermal conductivity material particles (such as VO2) dispersed in a binder resin matrix. This composite structure allows the material to exhibit temperature-dependent thermal conductivity changes while the binder resin provides adhesion to substrates and flexibility for shaping into various forms including curved surfaces.
Solution Approach 2:
The patent changes the physical and chemical parameters of the material system by selecting specific binder resins with appropriate glass transition temperatures and crosslinking densities. This allows the material to maintain both the thermal switching functionality and the mechanical properties needed for adhesion and shape processability across different temperature ranges.
2Temperature
If a material provides variable thermal conductivity for heat dissipation control, then thermal management is improved, but the material cannot be applied to complicated shapes such as curved surfaces
Solution Approach 1:
The patent forms the variable thermal conductivity material into thin film structures that can conform to curved and complicated surfaces. The binder resin matrix provides flexibility and adhesion, allowing the film to be applied to substrates with complex geometries while maintaining the embedded variable thermal conductivity particles in their functional positions.
3Temperature
If a material has sufficient thermal conductivity variation for effective heat dissipation control, then thermal management performance is improved, but adhesion to the object deteriorates
Solution Approach 1:
The patent creates a composite where the binder resin acts as both the matrix holding the variable thermal conductivity particles and the adhesive bonding to the substrate. By carefully selecting the binder resin type and concentration, the composite maintains strong adhesion while preserving the thermal conductivity variation properties of the embedded particles.
Solution Approach 2:
The patent applies the variable thermal conductivity material locally around heat generation sources where thermal management is most critical. The binder resin concentration and distribution are optimized in different regions to balance adhesion requirements with thermal functionality, allowing strong bonding at the substrate interface while maintaining thermal switching capability in the bulk material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting film exhibits excellent adhesion and shape processability, allowing for efficient heat flow control on various surfaces, including curved ones, while maintaining a high retention rate of thermal conductivity changes.
Implementation Method 1
a material whose thermal resistance changes is provided around a heat generation source, and the heat conduction of the material changes depending on the temperature
Implementation Method 2
a composition including a binder and a variable thermal conductivity material
Implementation Method 3
a method for producing a film, including: obtaining a film by crosslinking and curing after evaporating a solvent from the composition
Implementation Method 4
obtaining a film by crosslinking and curing after evaporating a solvent from the composition
Data Source
AI summary
A composition including a binder and a variable thermal conductivity material satisfying a conditional expression 1, wherein a content of the variable thermal conductivity material is from 300 parts by weight to 10,000 parts by weight with respect to a content of 100 parts by weight of the binder:κmax/κ25≥1.2 [conditional expression 1](wherein, κ25 represents a thermal conductivity at 25° C., and κmax represents the maximum value of a thermal conductivity at 200° C. or 500° C.).