Variable Thermal Resistance Burn-In Socket
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Solution Overview
Problem
Conventional burn-in temperature controllers for integrated circuits have fixed heat sink geometry, limiting temperature control flexibility and leading to overheating issues and increased power requirements due to excess cooling capacity, which is inefficient and power-intensive.
Innovation Solution
A thermal system with a variable thermal resistance between the heater and heat sink, allowing for dynamic adjustment of thermal resistance through materials like gallium, phase change materials, or moveable conductors, enabling precise temperature control of devices under test.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fixed heat sink geometry is used, then device structure is simple, but temperature control flexibility is limited and overheating occurs
Solution Approach 1:
The heat sink geometry is made dynamic and adjustable rather than fixed. The patent implements a variable heat sink configuration that can change its shape or size to adapt to different device power dissipation requirements, thereby improving temperature control flexibility while managing complexity through controlled adaptability.
Solution Approach 2:
The heat sink parameters (geometry, size, shape) are made variable to optimize thermal performance. By changing the heat sink parameters dynamically based on device power levels, the system achieves better temperature control flexibility without permanently increasing overall device complexity.
2Temperature
If chamber air temperature is raised to reduce cooling, then cooling capacity is reduced, but device overheating occurs
Solution Approach 1:
Instead of uniformly raising the chamber air temperature, the patent applies localized heating directly at the device level. Each device receives targeted supplemental heating through its own heater element, allowing the chamber air temperature to remain low for efficient cooling while individual devices achieve their required temperature targets, thus preventing overheating.
Solution Approach 2:
The heater elements are positioned to provide preliminary and direct heating to the devices before heat can be lost to the chamber environment. This preliminary heating action ensures devices reach their required temperatures efficiently without needing to raise the overall chamber air temperature, maintaining both reliability and energy efficiency.
3Reliability
If excess cooling capacity is maintained, then all devices can be cooled, but supplemental heating power requirements increase
Solution Approach 1:
The heat sink parameters (geometry, size, shape) are made variable to optimize thermal performance. By changing the heat sink parameters dynamically based on device power levels, the system achieves better temperature control flexibility without permanently increasing overall device complexity.
Solution Approach 2:
Instead of uniformly raising the chamber air temperature, the patent applies localized heating directly at the device level. Each device receives targeted supplemental heating through its own heater element, allowing the chamber air temperature to remain low for efficient cooling while individual devices achieve their required temperature targets, thus preventing overheating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The variable thermal resistance system improves temperature control accuracy and efficiency by reducing supplemental heating requirements, accommodating varying device power dissipation, and optimizing power usage during testing.
Implementation Method 1
The thermal resistance between the heater and the heat sink is a variable thermal resistance and can be adjusted based on a thermal profile of the system. In one example, the variable thermal resistance is provided by a phase change material, which is a solid at room temperature and softens and flows at or above a transition temperature that is above room temperature.
Implementation Method 2
The variable thermal resistance is placed between opposing surfaces of the heat sink and a contact element on the device package. The variable thermal resistance can also be provided by a moveable conductor element that has a first position wherein the first raised contact surface is interposed between the heat sink and the contact element.
Data Source
AI summary
A system and method introduce a variable thermal resistance to test and burn in apparatus. The system and method provide an efficient design for more accurate temperature control of integrated circuits. A system for testing integrated circuit (IC) packages comprises a plurality of IC testing socket bases arranged on a testing board and configured to receive a plurality of IC packages. A plurality of IC testing socket lids are arranged to attach to the testing board. Each IC testing socket lid comprises a temperature sensor to thermally contact the IC package and measure a surface temperature of the IC package, a heat sink is placed into either proximity to or directly in contact with the IC package, and an electronic controller to receive signals from the temperature sensor. A variable thermal resistance is introduced in the thermal conductive pathway formed from the device under test (DUT), the DUT contact and the heat sink such that the heat introduced into the system can be controlled and the adverse effects of unwanted cooling can be mitigated.