Variable Thickness Film Deposition on Non-Flat Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sputter film deposition systems are not designed for uniform deposition on non-flat substrates, particularly spherical substrates, which limits their application in Inertial Confinement Fusion (ICF) and other manufacturing processes where variable thickness films are required.
Innovation Solution
A gripping X-Y transfer stage within a directional film deposition chamber allows for the rotation and precise control of substrate positioning, enabling continuous and variable film thickness deposition on non-flat substrates, including spherical ones, by adjusting the seating layer and using stepper motors for precise movement and rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a standard directional sputter film deposition system is used, then uniform deposition on flat substrates is achieved, but deposition on non-flat substrates with variable thickness is not possible
Solution Approach 1:
The substrate is rotated during deposition to dynamically change its orientation relative to the sputter source, enabling variable thickness deposition on non-flat surfaces while maintaining control over film thickness distribution
Solution Approach 2:
The system transitions from static flat substrate deposition to dynamic three-dimensional substrate rotation, adding temporal and angular dimensions to the deposition process to achieve variable thickness on spherical and non-flat substrates
2Productivity
If spherical substrates are deposited using conventional systems, then deposition uniformity is poor, but manufacturing capacity remains limited
Solution Approach 1:
Rotation of spherical substrates during deposition enables uniform variable thickness patterns across the sphere surface while maintaining high manufacturing capacity through batch processing of multiple substrates
Solution Approach 2:
The deposition system is designed to handle both flat and spherical substrates, as well as produce both uniform and variable thickness films, making it universally applicable to multiple ICF target types and applications
3Manufacturing precision
If variable thickness patterns are deposited on non-flat substrates, then deposition control becomes complex, but manufacturing efficiency decreases
Solution Approach 1:
Periodic rotation of substrates during deposition creates controlled variable thickness patterns through repetitive angular cycles, enabling precise thickness modulation while maintaining continuous deposition flow and manufacturing efficiency
Solution Approach 2:
The deposition process continues uninterrupted while substrates rotate, maintaining continuous material flux and deposition rate while achieving variable thickness patterns, thus preserving manufacturing efficiency alongside precision control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-volume manufacturing of non-flat substrates with uniform or patterned film thickness, increasing manufacturing capacity and reducing unit costs, while maintaining the ability to handle a wide variety of materials and deposition patterns.
Implementation Method 1
A sputtering target 104, which acts as one electrode, is mounted in the system that consists of the material 110 desired to be deposited on a substrate 106
Implementation Method 2
An electrical voltage stimulus is applied between the upper and lower electrode that is composed of a high frequency component (usually in the MHz range) and optionally a low and/or DC component. This strikes a plasma, stripping electrons from the sputter gas and creating ions (Ar+) 108
Implementation Method 3
These ions are accelerated towards the sputtering target 104, hit the target, and knock off atoms 110 of the desired deposition material
Data Source
AI summary
A system and method for controllably varying the thickness of film deposition on a spherical or other non-flat substrate during high volume manufacturing is described. A gripping X-Y transfer stage rotates a substrate in-situ in a direction film deposition chamber. The transfer stage is driven at variable speeds to realize a desired distribution of film thickness variation around the surface of the substrate. Spatial variations in disposition thickness can be smoothly and continuously variable or abruptly changed.