Variable-Thickness Substrate Support for Uniform Wafer Heating
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving uniform temperature distribution on the surface of substrates during semiconductor device manufacturing.
Innovation Solution
A substrate processing apparatus is designed with a substrate support featuring plate-shaped structures that have varying thicknesses between the central and outer peripheral portions, allowing for differential heat capacity along the radial direction to enhance temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate support with uniform thickness plate-shaped structures is used, then the structure is simple and easy to manufacture, but the temperature distribution on the substrate surface becomes non-uniform
Solution Approach 1:
The plate-shaped structures are designed with non-uniform thickness distribution, where the central portion has a different thickness than the outer peripheral portion. This local variation in geometric properties creates differential heat capacity across the substrate support surface, enabling improved temperature distribution uniformity on the substrate while maintaining a relatively simple overall structure that is still manufacturable.
2Temperature
If the thickness of plate-shaped structures is varied to improve temperature uniformity, then temperature distribution improves, but the manufacturing complexity increases
Solution Approach 1:
The invention implements local quality variation through non-uniform thickness design of the plate-shaped structures. The central portion and outer peripheral portion have different thicknesses, creating specific heat capacity gradients that improve temperature uniformity. This localized geometric modification can be achieved through standard manufacturing techniques such as precision machining or molding, balancing manufacturing complexity with performance improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the uniformity of temperature distribution on the substrate surface, preventing hotspots and ensuring consistent processing results in semiconductor device manufacturing.
Implementation Method 1
a thickness of a central portion of a plate-shaped structure among the one or more plate-shaped structures is different from a thickness of an outer peripheral portion of the plate-shaped structure located outer of the central portion
Data Source
AI summary
A substrate processing apparatus includes a process chamber in which one or more substrates are processed; and a substrate support configured to support the one or more substrates in the process chamber. The substrate support includes one or more plate-shaped structures arranged in the substrate support in a manner corresponding to the one or more substrates, and a thickness of a central portion of a plate-shaped structure among the one or more plate-shaped structures is different from a thickness of an outer peripheral portion of the plate-shaped structure located outer of the central portion.