Variable-Thickness Metallic Base Plate for Portable X-Ray Imaging
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Solution Overview
Problem
Existing portable X-ray imaging apparatuses face challenges in achieving a balance between weight reduction and increased strength, as uniform thickness and support structures do not efficiently distribute load and enhance rigidity where needed.
Innovation Solution
The apparatus employs a tabular metallic base plate with varying thickness and ribbed support regions to optimize strength and weight distribution, including thicker areas under circuit boards and ICs, and thinner areas without components, while using ribs to enhance rigidity where necessary.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the base plate is increased uniformly across all regions, then the strength and rigidity of the apparatus is improved, but the weight of the apparatus increases
Solution Approach 1:
The base plate is designed with non-uniform thickness, having a first thickness in a first region and a second thickness smaller than the first thickness in a second region. This local quality variation allows the base plate to provide sufficient strength where needed while reducing weight in regions where less structural support is required.
Solution Approach 2:
The base plate is divided into multiple regions (first region and second region) with different thickness characteristics. This segmentation enables differential thickness design, where the first region can be thicker for structural support and the second region can be thinner for weight reduction, thus resolving the contradiction between strength and weight.
2Weight of moving object
If the thickness of the base plate is reduced to achieve weight reduction, then the weight of the apparatus decreases, but the strength and rigidity of the apparatus deteriorates
Solution Approach 1:
By implementing local quality through variable thickness design, the base plate maintains adequate strength in critical regions (first region with greater thickness) while achieving weight reduction in non-critical regions (second region with smaller thickness). This resolves the contradiction by ensuring strength where needed and reducing weight where permissible.
Solution Approach 2:
The thickness parameter of the base plate is changed across different regions rather than maintaining a uniform value. This parameter change allows optimization of both weight and strength by adjusting thickness locally according to structural requirements.
3Ease of manufacture
If uniform thickness is used throughout the base plate, then manufacturing simplicity is maintained, but weight reduction opportunities are lost
Solution Approach 1:
The base plate incorporates local quality through region-specific thickness variations. While this increases manufacturing complexity compared to uniform thickness, it enables significant weight reduction in the second region without compromising overall structural integrity, thus trading some manufacturing simplicity for weight reduction benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves an appropriate balance between weight reduction and increased strength, ensuring durability and reduced noise and heat generation, while maintaining efficient image processing and portability.
Implementation Method 1
a thickness of the tabular metallic base plate in a region where the circuit board is disposed is larger than the basic thickness
Implementation Method 2
a sensor panel configured to convert incident radiation to an electric signal
Data Source
AI summary
An X-ray imaging apparatus includes a sensor panel that converts incident radiation to an electric signal, a tabular metallic base plate including a front surface where the sensor panel is supported and a region where the tabular metallic base plate has a basic thickness, a circuit board disposed on a rear surface of the tabular metallic base plate, the rear surface being opposite to the front surface, wherein a thickness of the tabular metallic base plate in a region where the circuit board is disposed is larger than the basic thickness.