Variable Viscosity Adhesive for Substrate Handling
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Solution Overview
Problem
Existing carrying apparatuses for substrates during high vacuum evaporation processes, such as in OLED device production, face challenges with substrate breakage and inefficient material utilization due to the conventional down-facing substrate configuration and reliance on ordinary adhesives that do not effectively manage substrate handling in high vacuum environments.
Innovation Solution
A carrying apparatus with a variable viscosity adhesive assembly and supporting parts, utilizing a Peltier semiconductor element to control adhesive viscosity through temperature changes, allowing for secure adhesion and separation of substrates during processing, and featuring a movable supporting mechanism to minimize substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ordinary sticky objects are used to adsorb the back of the substrate, then the substrate can be held during processing, but the substrate is prone to breakage when separated
Solution Approach 1:
The patent applies the dynamics principle by making the adhesive viscosity controllable and changeable. The adhesive assembly can adjust its adhesive force dynamically - maintaining strong adhesion during vacuum evaporation processing while enabling easy separation after processing. This resolves the contradiction by transforming the static adhesive property into a dynamic one that adapts to different process stages, preventing substrate breakage during separation while ensuring reliable holding during processing.
Solution Approach 2:
The patent implements parameter changes by controlling the viscosity of the adhesive material. The adhesive assembly can change the viscosity parameter of the adhesive based on process requirements - maintaining high viscosity for strong adhesion during processing, then reducing viscosity to enable clean separation. This parameter control allows the system to achieve both reliable substrate holding and damage-free separation.
2Loss of substance
If the substrate is positioned with the evaporation face facing down, then material utilization rate improves and dust prevention is enhanced, but substrate handling and carrying become more difficult
Solution Approach 1:
The patent introduces an intermediary carrying apparatus that mediates between the substrate and the handling system. The carrying apparatus includes a carrying part with adhesive assembly that can securely hold the substrate in the down-facing position during vacuum evaporation processing, then facilitate easy removal and transfer. This intermediary device resolves the contradiction by providing specialized handling capabilities that maintain both material utilization benefits and operational ease.
Solution Approach 2:
The carrying apparatus applies dynamics by enabling flexible positioning and orientation control of the substrate. The adhesive assembly can maintain the substrate in the optimal down-facing position during processing, then dynamically adjust to facilitate easy carrying and transfer operations. This dynamic control allows the system to achieve both improved material utilization and enhanced ease of operation.
3Reliability
If a fixed viscosity adhesive is used, then the adhesive provides consistent holding force, but it cannot be easily controlled for both adhesion and separation
Solution Approach 1:
The patent applies the dynamics principle by making the adhesive viscosity controllable and changeable. The adhesive assembly can adjust its adhesive force dynamically - maintaining strong adhesion during vacuum evaporation processing while enabling easy separation after processing. This resolves the contradiction by transforming the static adhesive property into a dynamic one that adapts to different process stages, preventing substrate breakage during separation while ensuring reliable holding during processing.
Solution Approach 2:
The patent implements parameter changes by controlling the viscosity of the adhesive material. The adhesive assembly can change the viscosity parameter of the adhesive based on process requirements - maintaining high viscosity for strong adhesion during processing, then reducing viscosity to enable clean separation. This parameter control allows the system to achieve both reliable substrate holding and damage-free separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure and efficient handling of substrates in high vacuum environments by ensuring reliable adhesion and separation, reducing substrate breakage and improving material utilization, while allowing for quick and precise control of the adhesive's viscosity for effective substrate management.
Implementation Method 1
a variable temperature element and a thermal sensitive adhesive disposed on the variable temperature element, a temperature change of the variable temperature element causes the viscosity of the thermal sensitive adhesive to be changed
Data Source
AI summary
The present disclosure provides a carrying apparatus and a carrying method, the carrying apparatus includes: a carrying part configured to carry an object to be carried; an adhesive assembly disposed on the carrying part, a viscosity of the adhesive assembly is variable, and the carrying apparatus is configured to selectively adhere to or separate from the object to be carried according to a change of the viscosity; and a supporting part disposed on the carrying part and configured to support the object to be carried so that the object to be carried separates from the carrying part.