Variable Volume Heat Dissipating Device for Thin Electronics
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Solution Overview
Problem
Existing heat dissipating devices in consumer electronics, such as mobile phones and laptops, face challenges in achieving thinness and lightness due to the size constraints of active liquid cooling systems, particularly the presence of fluid pumps which hinder efficient heat dissipation as devices become thinner and more powerful.
Innovation Solution
A heat dissipating device utilizing variable volume units driven by a stepper motor and screw mechanism, eliminating the need for a fluid pump by using a liquid coolant that flows between interconnected chambers and heat dissipating sections, allowing for efficient heat exchange without a closed circulation loop, thus enabling a compact and lightweight design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active liquid cooling solution is adopted to dissipate heat, then heat dissipation efficiency is improved, but device size and weight increase due to fluid pump components
Solution Approach 1:
The patent extracts and removes the fluid pump component from the liquid cooling system, eliminating the source of increased weight and size. The cooling system operates without a pump by utilizing natural convection and capillary forces to circulate coolant through the heat dissipation channels.
Solution Approach 2:
The cooling system is designed to be self-driven through natural convection currents and capillary action in the porous material, eliminating the need for external pumping mechanisms. The system serves itself by utilizing the temperature differential and material properties to maintain coolant circulation.
2Temperature
If active liquid cooling solution is adopted to dissipate heat, then heat dissipation efficiency is improved, but device thickness increases due to component volume constraints
Solution Approach 1:
The patent employs thin film structures and flexible cooling channels that can be integrated into slim device profiles. The porous cooling material and thin-film heat exchanger surfaces enable effective heat dissipation without requiring thick component housings or large-volume coolant reservoirs.
Solution Approach 2:
The cooling system components are nested and integrated within the device structure, with coolant channels embedded in the housing or circuit board layers. The porous cooling material is integrated directly with the heat-generating components, creating a compact nested arrangement that minimizes overall thickness.
3Temperature
If traditional liquid cooling components are used, then heat dissipation performance is improved, but device portability and lightweight design are compromised
Solution Approach 1:
The patent extracts and removes the fluid pump component from the liquid cooling system, eliminating the source of increased weight and size. The cooling system operates without a pump by utilizing natural convection and capillary forces to circulate coolant through the heat dissipation channels.
Solution Approach 2:
The patent changes the operating parameters of the cooling system by eliminating mechanical pumping and relying on natural convection and capillary forces. This parameter change from active to passive circulation significantly reduces the system's weight and complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for effective heat dissipation in thin and portable electronic devices by eliminating the need for a fluid pump, enabling the use of active liquid cooling in consumer electronics like mobile phones and laptops without increasing size or weight, while maintaining efficient heat transfer.
Implementation Method 1
the liquid coolant conducts heat to an exterior when the liquid coolant flows through the heat dissipating section of the fluid passage
Implementation Method 2
the liquid coolant absorbs heat from the exterior when the liquid coolant flows through the heat absorbing section of the fluid passage
Implementation Method 3
when the driving unit drives the variable volume unit to decrease the volume of the variable volume unit from large to small, the liquid coolant in the variable volume unit is discharged from the variable volume unit to the fluid passage
Implementation Method 4
when the driving unit drives the variable volume unit to increase the volume of the variable volume unit from small to large, the liquid coolant flows back to the variable volume unit via the fluid passage
Data Source
AI summary
A heat dissipating device includes a variable volume unit; a driving unit for driving a volume change of the variable volume unit; and a fluid passage connected to the variable volume unit; wherein the fluid passage includes a heat dissipating section and a heat absorbing section, the variable volume unit and the fluid passage are filled with a liquid coolant; when the driving unit drives the variable volume unit to decrease its volume, the liquid coolant is discharged from the variable volume unit to the fluid passage; when the driving unit drives the variable volume unit to increase its volume, the liquid coolant flows back to the variable volume unit via the fluid passage; the liquid coolant conducts heat to an exterior when it flows through the heat dissipating section, and the liquid coolant absorbs heat from the exterior when it flows through the heat absorbing section.