Variable-Width Coil Pattern for Delamination-Resistant Inductors
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Solution Overview
Problem
In the development of high-performance, compact electronic devices, coil components face challenges such as delamination defects, reduced stiffness, and increased effective volume due to the need for fine coil patterns, which also affect the bonding strength with external electrodes and substrate warpage.
Innovation Solution
A coil component design featuring a coil pattern with varying line widths, where the outermost turns have a wider line width than adjacent turns, and the inclusion of sub-lead-out portions and sub-vias to enhance rigidity and prevent delamination, while maintaining inductance properties and reducing effective volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a fine coil pattern is used to achieve high capacity and high efficiency in a small size, then the coil component size is reduced, but delamination defects occur
Solution Approach 1:
The patent applies local quality by varying the line width of the coil pattern across different regions. The outermost turn has a first region with a first line width and a second region with a second line width greater than the first line width. This local variation in line width provides enhanced structural support at critical locations (outermost turn edges) to prevent delamination while maintaining fine pattern dimensions for compact size.
2Volume of moving object
If a fine coil pattern is used to achieve high capacity and high efficiency in a small size, then the coil component size is reduced, but the stiffness of the coil portion decreases
Solution Approach 1:
The patent enhances stiffness locally by increasing the line width at the second region of the outermost turn. This wider section provides additional structural rigidity to the coil portion without requiring the entire coil pattern to be coarser, thus maintaining compact overall size while securing necessary stiffness at critical structural locations.
3Reliability
If the line width of the coil pattern is increased to improve bonding strength and prevent delamination, then bonding strength improves, but the effective volume increases
Solution Approach 1:
The patent optimizes the balance between bonding strength and effective volume by selectively increasing the line width only at the second region of the outermost turn, while other portions of the coil pattern maintain finer line widths. This localized thickening provides enhanced bonding strength where it is most needed (at the outermost turn which has larger circumference and stress) without proportionally increasing the overall effective volume of the coil component.
4Reliability
If the line width of the coil pattern is increased to prevent delamination, then delamination is prevented, but substrate warpage occurs
Solution Approach 1:
The patent prevents substrate warpage while maintaining delamination prevention by concentrating the increased line width only at specific critical regions (the second region of the outermost turn) rather than uniformly increasing line width across the entire coil pattern. This localized approach provides sufficient bonding strength to prevent delamination at the most vulnerable locations without creating excessive overall stress that would cause substrate warpage.
Data Source
AI summary
A coil portion disposed in the body, and including a coil pattern including a plurality of turns, and a lead-out portion extended to one side surface of the body, and an external electrode disposed on the body and connected to the lead-out portion, wherein an outermost turn of the plurality of turns having a first region and a second region, and, wherein a line width of the second region is greater than a line width of the first region, and wherein the line width of the second region is greater than a line width of the most adjacent turn with the outermost turn.