Variable Width Interconnect Routing for IC Reliability
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Solution Overview
Problem
Current electronic design automation tools for integrated circuits lack the ability to automatically route interconnects with varying widths based on factors like current density, reliability, electromigration, and optical proximity effects, leading to potential reliability and performance issues due to inadequate current handling and power distribution.
Innovation Solution
A system and method for automatically routing interconnects using variable width lines, considering current density rules, electromigration, voltage drops, self-heating, and optical proximity effects, employing a shape-based approach that creates Steiner trees and adjusts net widths accordingly, allowing for efficient current handling and reliability enhancement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform width interconnect lines are used for automatic routing, then routing complexity is reduced and manufacturing is simplified, but current handling capability and reliability are insufficient due to inability to account for varying current density requirements
Solution Approach 1:
The patent applies local quality by varying the width of interconnect lines based on their specific current handling requirements. Each interconnect line is assigned a width tailored to its current density needs rather than using a uniform width across all lines. This is achieved through the router calculating required widths based on current values and applying appropriate width adjustments to specific segments, thereby improving reliability without requiring complete system redesign
Solution Approach 2:
The patent implements dynamics by making the interconnect width a variable parameter that adapts to different routing scenarios and current requirements. The routing system dynamically determines the appropriate width for each interconnect line based on calculated current values and design rules, rather than using a fixed uniform width. This dynamic adaptation allows the system to handle varying current density requirements while maintaining automated routing capabilities
2Reliability
If interconnect width is increased to handle higher current requirements, then current handling capability and reliability are improved, but chip area and manufacturing complexity increase
Solution Approach 1:
The patent applies local quality by selectively increasing the width of only those interconnect lines that have high current requirements, rather than uniformly increasing the width of all interconnect lines across the chip. The router calculates the specific current handling needs of each line and applies width adjustments only where necessary, thereby improving current handling reliability while minimizing the additional chip area required
Solution Approach 2:
The patent changes the width parameter of interconnect lines based on calculated current requirements and design rules. The system dynamically adjusts the width parameter for specific interconnect lines rather than applying a fixed parameter across all lines. This parameter change approach allows the system to optimize current handling capability while controlling the overall chip area by only modifying widths where necessary
3Reliability
If manual routing with variable width is used to optimize current handling, then reliability and current density compliance are improved, but routing time and productivity decrease significantly
Solution Approach 1:
The patent applies self-service by enabling the automatic routing system to independently calculate current requirements, determine appropriate widths, and generate variable width interconnect routes without requiring manual intervention. The router automatically applies design rules and calculates optimal widths based on current values, thereby maintaining high current density compliance while restoring productivity by eliminating the need for manual routing operations
Solution Approach 2:
The patent automatically changes the width parameter of interconnect lines based on calculated current requirements and design rules. The system performs parameter changes dynamically during the automated routing process, adjusting widths to comply with current density requirements without manual intervention. This automated parameter change capability maintains reliability while significantly improving productivity compared to manual routing methods
4Reliability
If variable width interconnect routing is implemented, then electromigration and voltage drop issues are reduced, but design complexity and manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by implementing variable width interconnect lines that are optimized for specific routing segments based on their electrical requirements. Each segment's width is locally optimized to prevent electromigration and voltage drop issues, rather than using a uniform width that cannot address localized problems. This localized optimization improves reliability while keeping manufacturing precision requirements manageable by applying changes only where necessary
Solution Approach 2:
The patent changes the width parameter of interconnect lines to optimize electrical performance and prevent electromigration and voltage drop issues. The system applies parameter changes based on calculated current requirements and design rules, adjusting widths to achieve reliable electrical performance. These controlled parameter changes improve electromigration resistance while maintaining manufacturing precision by using standardized width increments and adhering to design rule constraints
Data Source
AI summary
A system automatically routes interconnect of an integrated circuit design using variable width interconnect lines. For example, a first automatically routed interconnect may have a different width from a second automatically routed interconnect. The system will vary the width of the interconnect lines based on certain factors or criteria. These factors include current or power handling, reliability, electromigration, voltage drops, self-heating, optical proximity effects, or other factors, or combinations of these factors. The system may use a gridded or a gridless (or shape-based) approach.