Varistor-Integrated Ceramic Heat Sink for Semiconductor Protection
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Solution Overview
Problem
Existing electrical component arrangements lack effective heat-dissipating means for semiconductor components, particularly in protecting against electrostatic discharges and overvoltages without compromising the design or functionality of the semiconductor component.
Innovation Solution
A self-supporting electrical component arrangement featuring a highly heat-conducting ceramic heat sink that integrates both the semiconductor component and varistor body, allowing for efficient heat dissipation and protection against overvoltages, with the varistor body designed to provide nonlinear resistance without altering the semiconductor component's design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor component is protected against overvoltages by integrating heat-dissipating means, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The patent combines the heat-dissipating function and overvoltage protection function into a single integrated component. The varistor body is directly incorporated into the heat-dissipating means, eliminating the need for separate protection components and reducing overall device complexity while maintaining reliability
Solution Approach 2:
The heat-dissipating means is designed to serve multiple functions simultaneously: it dissipates heat from the semiconductor component and provides overvoltage protection through the integrated varistor body. This multi-functionality reduces the number of separate components needed in the arrangement
2Reliability
If the semiconductor component design is adapted for overvoltage protection, then the reliability is improved, but the ease of manufacture deteriorates
Solution Approach 1:
The overvoltage protection function is extracted from the semiconductor component itself and placed in a separate, dedicated varistor body that is integrated into the heat-dissipating means. This allows the semiconductor component to maintain its original design without modification while still receiving protection
Solution Approach 2:
The varistor body acts as an intermediary component between the semiconductor component and the heat-dissipating means. It provides overvoltage protection without requiring any changes to the semiconductor component design, facilitating easier manufacturing
3Productivity
If the varistor body is integrated into the heat-dissipating means, then the productivity is improved, but the device complexity increases
Solution Approach 1:
The varistor body is merged with the heat-dissipating means into a single integrated component. This combination reduces the number of separate parts that need to be assembled, thereby improving productivity despite the increased complexity of the individual heat-dissipating means structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat and protects semiconductor components from electrostatic discharges and overvoltages, enhancing the thermal conductivity and operational reliability of the component arrangement while maintaining the semiconductor component's original design and functionality.
Implementation Method 1
A support is provided as a heat-dissipating means, which contains a highly heat-conducting ceramic
Implementation Method 2
metal particles are contained as filler in the ceramic matrix of the heat sink, which already has good thermal conductivity. This measure increases the overall thermal conductivity of the heat sink even further
Implementation Method 3
the varistor body is preferably contacted in parallel with the semiconductor component to protect it from electrostatic discharges
Data Source
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AI summary
The invention relates to an electric component arrangement comprising a semiconductor component (1) and a varistor body (2) that is in contact with said semiconductor component for protecting said semiconductor component against electrostatic discharges. Said semiconductor component and the varistor body are arranged on a common support (3) that contains a good heat conducting ceramic.