Multilayer Chip Varistor Reflecting Layer for LED Efficiency
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Solution Overview
Problem
Conventional light emitting apparatus with semiconductor light emitting elements face challenges in achieving both high luminous efficiency and downsizing, as the space required for a light reflecting plate hinders miniaturization while omitting it degrades efficiency.
Innovation Solution
Incorporating a multilayer chip varistor with a reflecting layer between the semiconductor light emitting element and the varistor, which reflects light and prevents short circuits, allowing for efficient heat dissipation and assembly without the need for additional space, using materials like glass and metal or resin with metal oxides to enhance insulation and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a light reflecting plate is arranged around the semiconductor light emitting element, then luminous efficiency is improved, but the device size increases
Solution Approach 1:
The patent combines the light reflecting plate with the multilayer chip varistor into a single integrated component. The reflecting plate is formed on the same substrate as the varistor layers, eliminating the need for separate arrangement of these components. This merging achieves both high luminous efficiency through effective light reflection and compact device size by removing the spatial separation between components
Solution Approach 2:
The multilayer chip varistor is designed to perform multiple functions simultaneously: electrical protection (varistor function), light reflection (reflecting plate function), and structural support (substrate function). By making the varistor substrate serve as the base for the reflecting plate, the invention achieves multi-functionality that resolves the contradiction between luminous efficiency and device size
2Volume of moving object
If the light reflecting plate is excluded for downsizing, then device size is reduced, but luminous efficiency degrades
Solution Approach 1:
The reflecting plate is merged with the varistor structure, forming an integrated component where the reflecting plate is created on the varistor substrate. This integration ensures that light reflection functionality is maintained within the compact varistor footprint, preventing luminous efficiency degradation while achieving downsizing
Solution Approach 2:
The reflecting plate is nested within the overall device structure by forming it on the varistor substrate surface. This nesting approach allows the reflecting plate to occupy the same spatial envelope as the varistor, eliminating the need for additional external space while maintaining effective light reflection for high luminous efficiency
3Loss of energy
If a reflecting layer is disposed between the multilayer chip varistor and the semiconductor light emitting element, then light reflection is improved, but electrical insulation must be maintained
Solution Approach 1:
The reflecting layer is constructed as a composite material combining metal particles (for light reflection) dispersed in a glass or resin matrix (for electrical insulation). This composite structure simultaneously achieves high light reflection efficiency from the metal component and reliable electrical insulation from the glass or resin binder, resolving the contradiction between optical and electrical performance
Solution Approach 2:
The glass or resin matrix acts as an intermediary between the metal particles, providing electrical insulation while allowing the metal to perform its light reflection function. This intermediary material enables the reflecting layer to maintain both high reflectivity and proper electrical insulation properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high luminous efficiency while enabling the downsizing of the light emitting apparatus by effectively reflecting light and managing heat, preventing short circuits, and ensuring secure electrical connections.
Implementation Method 1
a reflecting layer disposed between the multilayer chip varistor and the semiconductor light emitting element and adapted to reflect light generated by the semiconductor light emitting element
Implementation Method 2
As the reflecting layer contains the metal, it has a good thermal conductivity and thus can efficiently dissipate heat from the semiconductor light emitting element
Implementation Method 3
Since the reflecting layer contains the glass, the reflecting layer can be obtained as one without electrical conductivity. Therefore, a short circuit can be prevented between the external electrodes of the multilayer chip varistor
Data Source
AI summary
A light emitting apparatus is comprised of a multilayer chip varistor having a varistor element body, a semiconductor light emitting element, and a reflecting portion. The varistor element body includes a varistor layer, and a plurality of internal electrodes opposed to each other so as to interpose the varistor layer between the internal electrodes. The semiconductor light emitting element is disposed on the multilayer chip varistor and is electrically connected to the plurality of internal electrodes so as to be connected in parallel to the multilayer chip varistor. The reflecting portion is disposed between the multilayer chip varistor and the semiconductor light emitting element. The reflecting portion reflects light traveling toward the multilayer chip varistor out of light generated by the semiconductor light emitting element.