Terminal Connecting Structure for Varistor Bonding Reliability
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Solution Overview
Problem
Conventional surface-mounted varistors face issues with bonding strength due to varying amounts of solder connecting terminals and electrodes, leading to potential overheating and increased product size and cost, as well as risks of exposure and short circuits during high voltage/large current pulses.
Innovation Solution
A terminal connecting structure with a clearance forming portion between the terminal and electrode, using a controlled amount of connecting material, such as solder, to ensure consistent bonding strength and prevent overheating, while maintaining a suitable product size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bulk size of the varistor is increased to handle high voltage/large current pulses, then the voltage surge absorption capability is improved, but the product size increases and cost increases
Solution Approach 1:
The invention divides the terminal structure into multiple segments: a terminal body, a connecting portion with projected portions, and clearances. This segmentation allows the solder to be confined to specific regions, enabling effective bonding without requiring excessive solder material or increased overall component size, thus maintaining compact dimensions while ensuring reliable electrical connection for high voltage surge absorption
Solution Approach 2:
The projected portions of the terminal act as intermediary elements that define the clearance boundaries. These projections serve as physical guides that control solder flow and distribution during the bonding process, ensuring consistent solder thickness and adequate bonding strength without increasing the overall product size
2Volume of moving object
If a small amount of connecting material is used to reduce product size and cost, then the product size and cost are reduced, but the bonding strength becomes insufficient
Solution Approach 1:
The invention creates local quality variations in the connecting material distribution by forming clearances with specific geometries defined by the terminal's projected portions. This ensures that the connecting material is concentrated where needed for optimal bonding strength, rather than being uniformly distributed, allowing adequate bonding with minimal material usage
Solution Approach 2:
The terminal's connecting portion is pre-formed with projected portions that define the clearance geometry before the bonding process. This preliminary structuring guides the connecting material to the precise locations and thicknesses required for optimal bonding, eliminating the need for excessive material and ensuring consistent bonding strength
3Strength
If an excessive amount of connecting material is used to ensure bonding strength, then the bonding strength is improved, but the thickness dimension of the solder becomes excessive and the terminal or element may be exposed from the outer package
Solution Approach 1:
The terminal structure is segmented into a terminal body and a connecting portion with projected portions that define clearance boundaries. This segmentation physically confines the connecting material within the clearance space, preventing excessive solder thickness and ensuring that the solder remains contained within the outer package while still providing adequate bonding strength
Solution Approach 2:
The invention changes the geometric parameters of the terminal's connecting portion by adding projected portions at specific locations. This parameter change creates clearances with controlled dimensions that directly control the connecting material thickness, ensuring it remains within the optimal range for bonding strength without causing exposure from the package
4Adaptability or versatility
If the thickness of the connecting material is varied to adapt to different connections, then adaptability is improved, but the bonding strength of the bonded portion varies
Solution Approach 1:
The terminal's connecting portion is pre-formed with projected portions that define standardized clearance geometries. This preliminary action ensures that the connecting material thickness is controlled and consistent across all connections, eliminating variability in bonding strength while maintaining adaptability through the standardized design that can accommodate different electrode configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses variations in bonding strength and thermal stress, enhancing the durability of electronic components against high voltage and large current pulses, and preventing short circuits by maintaining a controlled solder thickness and ensuring stable connections.
Implementation Method 1
the connecting material being configured to electrically connect the connecting portion and the electrode
Implementation Method 2
A terminal is connected to each of the electrodes, and the electrode and the terminal are bonded by using a solder
Data Source
AI summary
A terminal connecting structure is provided with each of the electrodes provided on the element forming the electronic component; and the terminals respectively having the connecting portions arranged along the electrodes respectively. In addition, the terminal connecting structure is provided with clearance forming portions configured to respectively form the respective clearances between the electrodes and the connecting portions respectively; and the connecting materials respectively provided in the clearances, the connecting material being configured to electrically connect the connecting portions and the electrodes respectively.