Varying-Cross-Section Dielectric Waveguide for Dense mmWave Interconnects

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Solution Overview

Problem

Conventional interconnect technologies, such as baseband copper cables or optical communication components, fail to achieve low latency, low cost, and low power for high data-rate communication, particularly in applications like deep learning, autonomous vehicle management, and virtual/augmented reality.

Innovation Solution

The use of dielectric waveguides, waveguide bundles, waveguide connectors, and transmission line structures enables high data-rate millimeter-wave communication in a dense, low-latency, and power-efficient manner, without the need for complex and expensive optical components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If conventional interconnect technologies (copper cables or optical components) are used, then communication infrastructure is established, but latency is high, power consumption is high, and cost is high

Engineering Contradiction:
ImprovelatencyVSAvoidcommunication infrastructure complexity
Core Design Contradiction:
Loss of timeVSDevice complexity

Solution Approach 1:

The patent replaces conventional electrical signaling through copper wiring with electromagnetic wave propagation through dielectric waveguides. This substitution of transmission mechanism enables millimeter-wave communication with lower latency and power consumption while maintaining signal integrity through the waveguide structure surrounded by dielectric materials.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the operating frequency parameter to millimeter-wave range and modifies the transmission medium properties by using dielectric waveguides with specific permittivity values (first dielectric material with permittivity between 2-10, second dielectric material with different permittivity). These parameter changes enable high data-rate communication with improved performance characteristics.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If dielectric waveguides are used for millimeter-wave communication, then bandwidth density and power efficiency are improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedata transmission rateVSAvoidwaveguide dimensional precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent employs composite dielectric material structures where a first dielectric material surrounds the waveguide opening and a second dielectric material surrounds the first dielectric material. This composite structure provides signal confinement and impedance control while offering manufacturing flexibility, as the layered approach allows for tolerance accumulation management and relaxed individual dimension tolerances compared to single-material waveguides.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides significant advantages over conventional technologies by achieving adequate bandwidth density, reducing crosstalk, and maintaining signal integrity at high data rates, while minimizing power consumption and latency.

Implementation Method 1

enables high data-rate millimeter-wave communication

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material

Methodology Applied
Scientific EffectDielectric confinement: Dielectric Permittivity

Data Source

PatentUS12126067B2Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material
Publication Date: 2024.10.22 INTEL CORP
  • US12126067B2 patent drawing
  • US12126067B2 patent drawing
  • US12126067B2 patent drawing

AI summary

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.