Voice Coil Motor Base Layout for High-Density IC Integration
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Solution Overview
Problem
Existing voice coil motors face challenges in efficiently utilizing circuit layout space due to limited integration of high-density integrated circuits, leading to restricted control functions and inflexible sensor placement.
Innovation Solution
A motor base design incorporating a high-density integrated circuit module with a rigid circuit board connected to metal branches, allowing for flexible spatial layout and enhanced control capabilities by integrating multiple sensors and coils through a high-density integrated circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional driver ICs with integrated Hall sensors are used, then sensor control is achieved, but circuit layout space is limited and sensor placement flexibility is reduced
Solution Approach 1:
The patent divides the circuit layout into two independent parts: metal circuits embedded in the base and a separate rigid circuit board. This segmentation allows the metal circuits to be minimized for basic connectivity while the rigid circuit board provides extensive space for high-density integrated circuits and flexible sensor placement, thereby resolving the contradiction between adaptability and area utilization.
Solution Approach 2:
The patent transitions from a two-dimensional planar layout (metal circuits on base) to a three-dimensional structure by adding a rigid circuit board that extends vertically from the base. This dimensional change creates additional layout space without increasing the base area, enabling both high integration density and flexible sensor positioning.
2Extent of automation
If more sensors and high-density integrated circuits are integrated, then control functions are enhanced, but the base circuit layout space becomes insufficient
Solution Approach 1:
The patent segments the circuit system into metal circuits embedded in the base (for basic connections) and a separate rigid circuit board (for high-density integration). This allows enhanced control functions to be achieved on the rigid circuit board without consuming additional base area, resolving the contradiction between automation extent and base space utilization.
Solution Approach 2:
The rigid circuit board acts as an intermediary carrier that bridges the metal circuits in the base and the high-density integrated circuits. It provides the necessary space and connectivity for enhanced control functions while keeping the base structure compact, thus resolving the space limitation contradiction.
3Quantity of substance
If metal circuits are limited by stamping process minimum size, then circuit integration density is restricted, but increasing circuit density requires more layout space
Solution Approach 1:
The patent separates the circuit system into metal circuits (stamped in base) and rigid circuit board circuits. The metal circuits handle basic connections with minimal space, while the rigid circuit board provides high-density trace routing and component placement. This segmentation enables high circuit integration density without requiring proportional increases in base area.
Solution Approach 2:
The patent moves high-density circuit integration from the two-dimensional base plane to a three-dimensional structure using a rigid circuit board that extends vertically. This allows circuit traces and components to be arranged in additional spatial dimensions, achieving high integration density without expanding the base footprint.
Data Source
AI summary
A motor base, a voice coil motor and a manufacturing method thereof are disclosed. The motor base includes a plurality of metal branches, an insulating base injection-molded on the plurality of metal branches, at least one first electronic component mounted on the insulating base and electrically connected to the metal branches, and a high-density integrated circuit module. The high-density integrated circuit module includes a rigid circuit board and a high-density integrated circuit soldered to the rigid circuit board. The rigid circuit board is provided with a plurality of conductive sheets arranged at intervals. The conductive sheets are electrically connected to the metal branches embedded in the insulating base, so that the high-density integrated circuit is electrically connected to the first electronic component through the metal branches. It can more reasonably utilize the circuit layout space of the motor base, allowing the high-density integrated circuit to utilize a larger space.