VCSEL Aperture Ratio Optimization for High-Speed Data Communication

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Solution Overview

Problem

Traditional VCSEL designs suffer from high parasitic capacitance, which hinders their ability to operate as high-speed, high-bandwidth devices, and they fail to meet reliability constraints in high-speed applications.

Innovation Solution

The VCSEL design constrains parasitics by optimizing the ratio of the VCSEL aperture diameter defined by the second reflector and the oxidation profile, and uses a semi-insulating GaAs or Si substrate with a buffer layer to improve reliability, allowing for reduced capacitance and enhanced performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If traditional VCSEL designs are used, then manufacturing is simpler, but parasitic capacitance is too high for high-speed operation

Engineering Contradiction:
Improvedata communication speedVSAvoidparasitic capacitance
Core Design Contradiction:
SpeedVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by optimizing the aperture diameter ratio between the VCSEL aperture and oxidation profile, and by controlling the oxidation depth parameter. These parameter adjustments reduce parasitic capacitance while maintaining manufacturing feasibility, enabling high-speed operation at 50 Gbps or higher.

Inventive Principle:
Principle #35Parameter changes

2Speed

If high-speed VCSEL designs are attempted, then data communication speed improves, but reliability constraints are not met

Engineering Contradiction:
Improvedata communication speedVSAvoiddevice reliability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent applies local quality by using a semi-insulating GaAs or Si substrate with a buffer layer specifically at the substrate interface region. This localized structural modification improves overall device reliability while maintaining high-speed performance, addressing the reliability constraints without sacrificing speed.

Inventive Principle:
Principle #3Local quality

3Area of moving object

If VCSEL aperture diameter is increased, then emission area increases, but parasitic capacitance increases

Engineering Contradiction:
Improveemission areaVSAvoidparasitic capacitance
Core Design Contradiction:
Area of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent resolves this contradiction by changing the parameter relationship between aperture diameter and oxidation profile diameter. By optimizing their ratio and controlling oxidation depth, the design achieves larger emission area with minimized parasitic capacitance, enabling both high area and high-speed operation.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11563307B2High speed high bandwidth vertical-cavity surface-emitting laser
Publication Date: 2023.01.24 MELLANOX TECHNOLOGIES LTD(IL)
  • US11563307B2 patent drawing
  • US11563307B2 patent drawing
  • US11563307B2 patent drawing

AI summary

Example vertical cavity surface emitting lasers (VCSELs) include a mesa structure disposed on a substrate, the mesa structure including a first reflector, a second reflector defining at least one diameter, and an active cavity material structure disposed between the first and second reflectors; and a second contact layer disposed at least in part on top of the mesa structure and defining a physical emission aperture having a physical emission aperture diameter. The ratio of the physical emission aperture diameter to the at least one diameter is greater than or approximately 0.172 and/or the ratio of the physical emission aperture diameter to the at least one diameter is less than or approximately 0.36. An example VCSEL includes a substrate; a buffer layer disposed on a portion of the substrate; and an emission structure disposed on the buffer layer.