VCSEL Array with Arc Heat Sink for Optical Convergence
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Solution Overview
Problem
High-power semiconductor lasers based on edge-emitting technology suffer from catastrophic optical damage, leading to a significantly reduced actual lifespan compared to their expected lifespan, limiting their application in industrial and medical fields.
Innovation Solution
A high-power semiconductor laser using a VCSEL module with a VCSEL chip array and an inner wall reflective optical transmission device, where the VCSEL chips are densely arranged or angled to form a planar or arc-shaped light emitting surface, enabling efficient secondary reflection and convergence of light rays, and a package structure with an arc-shaped heat sink to focus light beams at a circle center.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If edge-emitting semiconductor lasers are used to achieve high-power output, then laser power can be increased, but catastrophic optical damage occurs leading to reduced actual lifespan
Solution Approach 1:
The patent divides the light source into multiple VCSEL chips arranged in an array, where each chip emits laser light independently. This segmentation allows the system to achieve high total power output while each individual chip operates at a lower, safer power level that avoids catastrophic optical damage, thereby extending actual lifespan.
Solution Approach 2:
The patent combines multiple VCSEL chips into a single array structure with integrated optical transmission devices and heat dissipation systems. By merging the outputs of multiple low-power chips, the system achieves high-power output equivalent to single high-power lasers but with improved reliability and reduced optical damage risk.
2Productivity
If VCSEL chips are densely arranged to form planar or arc-shaped light emitting surfaces, then optical convergence efficiency is improved, but device complexity increases
Solution Approach 1:
The patent employs arc-shaped light emitting surfaces formed by VCSEL chips arranged along a circular arc, with each chip's light emission direction oriented toward the center of the arc. This curved geometry naturally focuses light rays to converge at the center point, significantly improving optical convergence efficiency without requiring complex external optical components.
Solution Approach 2:
The patent transitions from traditional planar VCSEL arrays to three-dimensional arc-shaped arrangements, utilizing spatial curvature to achieve optical convergence. By arranging chips along an arc rather than a flat surface, the system exploits the geometric properties of curved surfaces to focus light naturally, reducing the need for additional optical focusing elements.
3Power
If inner wall reflective optical transmission devices are used to converge light rays, then optical power density is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The inner wall of the optical transmission device is designed with a reflective curved surface that follows a circular arc geometry. This curved reflective surface passively directs and converges light rays from multiple VCSEL chips toward the center focal point, enhancing optical power density without requiring complex active optical components or ultra-precise alignment mechanisms.
Solution Approach 2:
The reflective optical transmission device structure itself performs the light convergence function through its geometric design. The curved inner wall automatically directs light rays to the focal point based on the arc geometry, making the structure self-focusing without requiring external optical elements or complex adjustment mechanisms, thereby reducing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances laser emitting efficiency, target object absorptivity, and optical power density, improving the practicality and reliability of VCSEL-based high-power semiconductor lasers for industrial and medical applications by extending their lifespan and maintaining high performance under high temperatures.
Implementation Method 1
an inner wall reflective optical transmission device disposed in front of a light emitting surface of the VCSEL chip array
Implementation Method 2
A light emitting direction of a VCSEL is perpendicular to an epitaxial wafer direction, and light is emitted from a top surface of a reaction region
Implementation Method 3
a package structure with an arc-shaped heat sink to focus light beams at a circle center
Data Source
AI summary
Provided is a high-power semiconductor laser based on VCSEL, comprising a VCSEL laser module. The VCSEL laser module includes a VCSEL chip array (1) consisting of a plurality of VCSEL chips (10) and an inner wall reflection optical transmission device (2) which is arranged in front of a light emergent face of the VCSEL chip array (1); and the light emergent face of the VCSEL chip array (1) is used for secondarily reflecting the reflected light reflected by a target object (3) and the inner wall reflection optical transmission device (2). Also provided is a packaging structure for the high-power semiconductor laser. The VCSEL chip array (1) is packaged by an inwardly concave arc-shaped heat sink (4), so that the purpose of converging the laser light beam near a centre position can be achieved.