VCSEL Array Fuse Architecture for Defective Emitter Isolation
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Solution Overview
Problem
Emitter arrays in semiconductor-based light emitting devices often suffer from defective emitters due to manufacturing challenges, leading to electrical failures such as shorts or opens, which can disrupt the entire array's functionality, especially in applications like LIDAR systems where reliability is critical.
Innovation Solution
Incorporating an integrated fuse structure within the semiconductor structure of each emitter, which can be actuated to an electrically open state by a control signal, allowing for selective isolation of failed emitters and preventing cascading failures, thereby enhancing the array's self-healing capabilities and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If emitter arrays are fabricated using Micro-Transfer Printing (MTP) technology, then power scaling and high power density are achieved, but electrical failures and defective emitters increase due to manufacturing challenges
Solution Approach 1:
The patent divides the emitter array into independently controllable units by integrating fuse structures with each emitter or group of emitters. This segmentation allows individual defective emitters to be isolated without affecting the operation of other emitters in the array, thereby maintaining overall system reliability while preserving the high power density capability of the MTP-fabricated array.
Solution Approach 2:
The patent introduces fuse structures that can change their electrical state from conductive to non-conductive through application of a control signal (voltage pulse). This parameter change enables dynamic reconfiguration of the emitter array to bypass defective elements, resolving the contradiction between maintaining high power output and ensuring reliable operation despite manufacturing defects.
2Adaptability or versatility
If discrete emitter devices are used in arrays, then flexibility in array configuration is improved, but electrical screening becomes impractical or impossible leading to defective emitters
Solution Approach 1:
The patent implements self-service by providing each emitter or group of emitters with an integrated fuse structure that can be actuated to isolate defective units. This self-diagnosis and self-isolation capability eliminates the need for complex external electrical screening processes, allowing discrete emitter arrays to maintain flexibility while compensating for the inability to perform thorough quality control during manufacturing.
3Reliability
If integrated fuse structures are added to each emitter, then self-healing capabilities and reliability are enhanced, but device complexity increases
Solution Approach 1:
The patent merges the fuse structure directly with the emitter device, integrating the protection function into the existing emitter architecture rather than adding separate external protection circuits. This merging approach enhances reliability through self-healing capabilities while minimizing the increase in device complexity by utilizing the existing electrical pathways and structures of the VCSEL or LED emitter.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated fuse structure effectively reduces the impact of defective emitters by isolating them, ensuring continued operation of the emitter array and improving the overall reliability and performance of light-based 3D measurement systems like LIDAR.
Implementation Method 1
The integrated fuse structure has a greater resistance than one or more elements that are electrically coupled in series between the first and second electrical contacts
Implementation Method 2
a light emitting device includes a semiconductor structure comprising an n-type layer, an active region, and a p-type layer
Implementation Method 3
semiconductor light emitter elements (including one or more LEDs or lasers)
Data Source
AI summary
A light emitting device includes a semiconductor structure comprising an n-type layer, an active region, and a p-type layer, first and second electrical contacts on the n-type layer and the p-type layer, respectively, and an integrated fuse structure in or on the semiconductor structure. The integrated fuse structure is electrically coupled in series between the first and second electrical contacts, and is actuatable to provide an electrically open state between the first and second electrical contacts responsive to a control signal. Related emitter arrays, methods of fabrication, and methods of operation are also discussed.