VCSEL Array Thermal Management via Bottom Heat Dissipation
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Solution Overview
Problem
Surface emitting semiconductor laser arrays experience variations in wavelength and optical output due to temperature differences between laser elements, which is undesirable for applications in electrophotographic systems and optical communication, necessitating improved temperature uniformity.
Innovation Solution
A surface emitting semiconductor laser design featuring a substrate with stacked layers including a first and second conductivity-type semiconductor multilayer reflector, an active layer, and a heat dissipating metal member, where the semiconductor layer is formed to enhance thermal conductivity and heat dissipation by connecting the heat dissipating member to the semiconductor layer, and the arrangement of heat dissipating members in a VCSEL array is optimized to ensure uniform temperature across the array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If surface emitting semiconductor lasers are arranged in an array for two-dimensional integration, then the quantity and integration capability are improved, but temperature uniformity deteriorates due to heat accumulation between adjacent elements
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent heat dissipation structures, each corresponding to individual laser elements or groups of elements. This segmentation allows independent thermal management for each region, preventing heat accumulation from affecting the entire array uniformly and maintaining temperature consistency across different elements.
Solution Approach 2:
The patent introduces heat dissipation structures as intermediary elements between the laser active regions and the substrate. These intermediate heat dissipation structures act as thermal mediators that conduct heat away from the laser elements before it can accumulate and affect temperature uniformity across the array.
2Ease of manufacture
If conventional heat dissipation structures are used in VCSEL arrays, then manufacturing simplicity is maintained, but wavelength stability deteriorates due to temperature variations
Solution Approach 1:
The patent applies different heat dissipation structures or configurations to different regions of the VCSEL array based on local thermal requirements. By optimizing heat dissipation locally for each element or group of elements, the patent achieves better wavelength stability without requiring complete redesign of the entire array structure, thus maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved heat dissipation and temperature uniformity across the VCSEL array, stabilizing the wavelength and optical output, thus enhancing performance in applications requiring consistent laser emission.
Implementation Method 1
the heat dissipating metal member is connected to the semiconductor layer exposed at the bottom portion of the columnar structure
Data Source
AI summary
A surface emitting semiconductor laser includes a substrate, a first conductivity-type first semiconductor multilayer reflector, an active layer, a semiconductor layer, a second conductivity-type second semiconductor multilayer reflector that includes a current confinement layer, and a heat dissipating metal member. At least the first semiconductor multilayer reflector, the active layer, the semiconductor layer, and the second semiconductor multilayer reflector are stacked in this order on the substrate. A columnar structure having a top portion, a side surface, and a bottom portion is formed from the second semiconductor multilayer reflector to the semiconductor layer. The heat dissipating metal member is connected to the semiconductor layer exposed at the bottom portion of the columnar structure.