VCSEL Chip Double Topological Structures Wafer Density
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Solution Overview
Problem
Conventional VCSEL chips with single topological structures limit the number of chips that can be produced per wafer due to fixed spacing requirements, leading to increased manufacturing costs in multi-channel optical communication systems.
Innovation Solution
The introduction of double topological structures for VCSEL chips, where two active areas with electrode pads and wires are obliquely arranged on a substrate, allowing for reduced spacing between adjacent chips and increased chip density on a wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If single topological structure VCSEL chips are used with fixed 250 micron spacing, then compatibility with conventional optical fiber systems is maintained, but the number of chips per wafer is limited and manufacturing cost increases
Solution Approach 1:
The VCSEL chip is divided into two separate topological structures (first and second topological structures) on the same substrate. Each topological structure contains its own active area, electrode pad, and wire connection, allowing independent optimization of each structure while maintaining overall system compatibility
Solution Approach 2:
The patent transitions from a single topological structure to a dual topological structure arrangement on the same substrate plane. This dimensional expansion allows two complete VCSEL units to be produced from one chip substrate, effectively doubling the chips-per-wafer yield while maintaining standard 250 micron spacing compatibility
2Reliability
If standard 250 micron spacing is maintained between active areas, then fiber coupling compatibility is ensured, but wafer area utilization is inefficient and individual chip cost increases
Solution Approach 1:
Two complete VCSEL topological structures are merged onto a single chip substrate. The first and second topological structures share the same substrate and are both connected to external circuits, allowing dual-functionality from a single chip unit while maintaining standard spacing for fiber coupling
Solution Approach 2:
The VCSEL chip is designed with universal compatibility for conventional optical fiber systems through maintained 250 micron spacing, while simultaneously providing dual topological structures that double the functional output per chip, achieving multi-functionality without sacrificing compatibility
3Ease of manufacture
If chip units are arranged with fixed 250 micron spacing on wafer, then assembly simplicity is maintained, but the cost of individual VCSEL chips increases due to wasted wafer area
Solution Approach 1:
The chip design segments functionality into two independent topological structures that can be independently activated or configured, allowing flexible assembly options while maintaining standard spacing for compatibility with existing manufacturing and assembly processes
Solution Approach 2:
The patent changes the structural parameter from single-topology to dual-topology while maintaining the critical spacing parameter at 250 microns. This parameter change allows doubled productivity without affecting assembly simplicity or compatibility with existing manufacturing infrastructure
Data Source
AI summary
The present invention relates to a unitized laser chip with double topological structures, which comprises a first topological structure, a second topological structure and a substrate, the first topological structure and the second topological structure are simultaneously arranged on the substrate, and the unitized laser chip is formed by the first topological structure, the second topological structure and the substrate. The first topological structure comprises a first active area, a first electrode bonding pad and a first wire connected between the first active area and the first electrode bonding pad, and the second topological structure comprises a second active area, a second electrode bonding pad and a second wire connected between the second active area and the second electrode bonding pad. The first topological structure and the second topological structure are obliquely arranged on the substrate at the same time.