VCSEL–Detector Optoelectronic Assembly With Confined Interconnects
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Solution Overview
Problem
Existing optical devices using optical electronic assemblies require separate mounting systems for individual optical electronic elements, leading to large spacings and inefficiencies due to larger tolerances in PCB and trace manufacturing, resulting in increased package profile and degraded system-level performance.
Innovation Solution
An optical transceiver device with a printed circuit board (PCB) and integrated circuit (IC) substrate that integrates a vertical-cavity surface-emitting laser (VCSEL) and optical detector on a single IC substrate, using conductive pillars and interconnection layers to confine electrical communication paths, reducing spacing and reliance on PCB traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate mounting substrates (PCB and individual IC substrates) are used for optical electronic elements, then ease of manufacture is improved, but device size and spacing increase due to larger tolerances
Solution Approach 1:
The patent merges multiple separate mounting substrates (PCB and individual IC substrates) into a single integrated substrate structure. The optical electronic elements are mounted directly on one substrate, eliminating the need for separate PCB and IC substrate assemblies, thereby reducing overall package size while maintaining manufacturing feasibility
Solution Approach 2:
The single substrate serves multiple functions simultaneously: it acts as the mounting platform for optical electronic elements, provides electrical interconnections through conductive pillars, and enables direct coupling between components. This multi-functional substrate replaces the roles previously fulfilled by separate PCB and IC substrates
2Ease of manufacture
If separate mounting substrates are used for optical electronic elements, then ease of manufacture is improved, but spacing between elements increases resulting in degraded system-level performance
Solution Approach 1:
By combining multiple functional layers into a single integrated substrate, the patent reduces the spacing between optical electronic elements. This direct integration eliminates the tolerance accumulation that occurs with separate substrates, improving signal integrity and system-level performance while keeping manufacturing processes manageable
3Ease of manufacture
If PCB traces are used for electrical interconnections, then ease of manufacture is improved, but parasitics and latency increase
Solution Approach 1:
The patent extracts the electrical interconnection function from traditional PCB traces and relocates it to conductive pillars formed directly within the substrate. This extraction eliminates the need for lengthy PCB trace paths, reducing parasitic inductance and capacitance while maintaining manufacturing simplicity through standard substrate fabrication processes
Solution Approach 2:
The patent replaces the mechanical PCB trace interconnection system with a direct conductive pillar system integrated into the substrate. This substitution reduces the physical path length for electrical signals, thereby reducing latency and parasitics while maintaining ease of manufacture through conventional substrate processing
Data Source
AI summary
An optoelectronic assembly includes a printed circuit board (PCB), an integrated circuit (IC) substrate operably mounted on the PCB, the IC substrate comprising at least one of active elements and passive elements, a vertical-cavity surface-emitting laser (VCSEL) operably mounted on a first surface of the IC substrate, an optical detector operably mounted adjacent to the VCSEL on the first surface of the IC substrate, and a molding compound formed on the IC substrate encapsulating a plurality of sides of the VCSEL and a plurality of sides of the optical detector, in which at least one electrical communication path between the optical detector and the VCSEL is confined within the IC substrate.