VCSEL Module Electrode Layout for Smaller Laser Substrates
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Solution Overview
Problem
Existing surface emitting laser substrates, such as VCSEL devices, are unable to meet the demand for size reduction effectively.
Innovation Solution
A surface emitting laser module design that includes a base substrate with integrated electrodes and an optical member, where the VCSEL chip is flip-chip mounted and bonded with an MLA using self-alignment, allowing for reduced size and efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the microlens array is mounted on the VCSEL device surface with electrode pads outside the contact area, then the device can be assembled, but the substrate size cannot be sufficiently reduced
Solution Approach 1:
The patent merges the electrode pads with the microlens array structure by forming the electrode pads on the same substrate as the microlens array. This integration allows the electrode pads to be positioned within the microlens array contact area, eliminating the need for separate electrode pad areas and reducing the overall substrate size while maintaining assembly feasibility through co-fabrication of both optical and electrical components
Solution Approach 2:
The patent utilizes the vertical dimension by forming electrode pads that extend through the substrate thickness and making electrical connections via wire bonding from the rear surface. This three-dimensional arrangement allows electrode pads to be compact in the planar view while still providing adequate electrical access, thereby reducing substrate area without compromising electrical functionality
Data Source
AI summary
A surface emitting laser module includes a base substrate, a surface emitting laser substrate mounted on the base substrate, the surface emitting laser substrate including a surface emitting laser element, and the surface emitting laser substrate having a first face facing the base substrate and a second face facing away from the base substrate, and an optical member facing the second face and including an optical element configured to receive light emitted from the second face of the surface emitting laser element. The surface emitting laser element includes a first semiconductor layer, a second semiconductor layer, a first electrode provided on the first face and connected to the first semiconductor layer, and a second electrode provided on the first face and connected to the second semiconductor layer. The base substrate includes a third electrode connected to the first electrode and a fourth electrode connected to the second electrode.