VCSEL Illuminator Module with Pad Feedthroughs
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Solution Overview
Problem
Existing miniature illuminators for mobile devices, such as cell phones and tablets, face challenges in achieving high optical power while maintaining laser eye safety and compatibility with high-volume, low-cost manufacturing and surface mount assembly practices, with complex packaging technologies and the need for additional components like spacers.
Innovation Solution
The development of a Vertical Cavity Surface Emitting Laser (VCSEL) illuminator module with a single molded structure that includes electrical pad feedthroughs for surface mount soldering, incorporating a laser safety interrupt feature that deactivates the VCSEL if the optical component is damaged, and utilizing high-power VCSEL devices with multiple gain groups separated by tunnel junction diodes for efficient electro-optic conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex packaging technology is used to achieve high optical power and laser eye safety, then the optical performance and safety are improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple functions into a single integrated submount structure that includes: (1) electrical connection functionality through conductive pathways, (2) optical beam modification through integrated optical elements, and (3) laser safety interrupt functionality through interlocked electrical contacts. This merging eliminates the need for separate spacers, mounting brackets, and safety components, thereby reducing device complexity while maintaining reliability
Solution Approach 2:
The submount structure serves multiple functions simultaneously: it provides mechanical support for the VCSEL, electrical connection pathways for current supply, optical beam modification capabilities, and laser safety interrupt functionality. This multi-functionality reduces the number of separate components needed, simplifying the overall packaging while achieving high optical power and safety requirements
2Manufacturing precision
If additional components like spacers are used to ensure proper alignment and safety, then the optical precision and safety are improved, but the manufacturing cost and assembly complexity increase
Solution Approach 1:
The patent integrates alignment features directly into the submount structure, eliminating the need for separate spacers. The submount includes built-in mechanical features that ensure precise alignment between the VCSEL and optical elements during assembly, achieving optical precision through integration rather than through multiple separate alignment components
3Stability of the object's composition
If traditional packaging methods are used, then the structural stability is maintained, but the suitability for high-volume surface mount assembly is reduced
Solution Approach 1:
The patent replaces traditional mechanical packaging structures with an integrated submount that combines electrical, optical, and mechanical functions. The electrical connection pathways are formed as integral parts of the submount structure rather than through separate mechanical connectors, enabling automated surface mount assembly while maintaining structural stability
Solution Approach 2:
The submount structure provides universal functionality for electrical connection, optical beam modification, and mechanical support in a single component designed for surface mount assembly. This integration enables the illuminator to be assembled using high-volume surface mount techniques while maintaining structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the production of high-power miniature illuminators suitable for 3D image recording and motion sensing, meeting laser eye safety regulations, and simplifies packaging by eliminating the need for extra components, while allowing for high-volume, low-cost manufacturing and surface mount assembly.
Implementation Method 1
utilizing high-power VCSEL devices with multiple gain groups separated by tunnel junction diodes for efficient electro-optic conversion
Implementation Method 2
an optical element positioned on the module adjacent to an emitting surface of the VCSEL device, the optical element being configured to modify the optical beam generated by the VCSEL device
Implementation Method 3
a module forming a physical cavity having first electrical contact pads positioned on an inner surface of the module that are electrically coupled through the module to second electrical contact pads positioned on an outer surface of the module
Data Source
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AI summary
A VCSEL illuminator module includes a module forming a physical cavity having electrical contacts positioned on an inner surface of the module that feed through the module to electrical contacts positioned on an outer surface of the module. A VCSEL device is positioned on the inner surface module and includes electrical contacts that are electrically connected to the electrical contacts on the inner surface of the module. The VCSEL device generates an optical beam when current is applied to the electrical contacts. An optical element is positioned adjacent to an emitting surface of the VCSEL device and is configured to modify the optical beam generated by the VCSEL device.