VCSEL Light Source Layout for Thermal Isolation of Driver Circuits
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Solution Overview
Problem
In distance measurement applications using structured light (STL) or time of flight (ToF) methods, the temperature of vertical-cavity surface-emitting laser (VCSEL) light-emitting elements and their driving circuits tends to rise due to heat generation, leading to potential malfunctions such as reduced emission efficiency and degraded circuit characteristics.
Innovation Solution
The light source apparatus is designed with a non-overlapping arrangement between the emission section containing a plurality of VCSEL light-emitting elements and the driving section, which includes a configuration where at least a portion of the driving elements' region does not overlap with the emission section. This arrangement reduces heat transfer between the driving elements and the light-emitting elements, and between the light-emitting elements and the driving circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the driving section is disposed to overlap with the emission section, then the device complexity is reduced and integration is improved, but the temperature of the light-emitting elements and driving circuit rises due to heat generation
Solution Approach 1:
The patent divides the device into distinct overlapping and non-overlapping regions. The driving section is segmented such that its active region overlaps with the emission section to reduce complexity, while its peripheral regions are positioned non-overlapping to dissipate heat. This spatial segmentation allows simultaneous achievement of integration and thermal management.
Solution Approach 2:
Different regions of the driving section are assigned different spatial relationships with the emission section. The central active region overlaps with the emission section for compact integration, while peripheral regions are positioned away from the emission section to serve as heat dissipation zones. This local differentiation optimizes both integration and thermal performance.
2Length of moving object
If the driving elements are positioned close to the light-emitting elements, then the wiring length is reduced and wiring resistance is lowered, but heat transfer between driving elements and light-emitting elements increases
Solution Approach 1:
The patent resolves the contradiction by transitioning from a one-dimensional proximity relationship to a two-dimensional spatial arrangement. The driving elements are positioned both close to and away from the light-emitting elements in different regions, creating a complex spatial relationship that simultaneously achieves short wiring lengths in overlapping regions while maintaining heat dissipation pathways in non-overlapping regions.
Data Source
AI summary
A suppression of a rise in temperature is to be attained for a light source apparatus provided with an emission section in which a plurality of vertical-cavity surface-emitting laser light-emitting elements is arrayed. A light source apparatus according to the present technology includes an emission section in which a plurality of vertical-cavity surface-emitting laser light-emitting elements is arrayed, and a driving section configured to cause the plurality of light-emitting elements of the emission section to emit light, in which at least a portion of a region including driving elements in the driving section is disposed so as not to overlap with the emission section.