VCSEL Microlens Assembly With Same-Surface Contacts for Compact 3D Sensing
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Solution Overview
Problem
Conventional projector modules for 3D sensing applications, such as time-of-flight systems, are bulky due to the inclusion of an IC driver chip, a photodiode, and optical elements like lenses and diffractive optical elements, which restrict their integration into user devices like smartphones, and suffer from high thermal resistance and reduced optical power output.
Innovation Solution
An optical assembly with a VCSEL device disposed vertically over an IC driver chip on a thermally conductive substrate, incorporating a microlens component to collimate light and eliminate the need for additional lenses, and direct electrical and thermal contacts on the same surface, allowing for reduced size and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional projector modules include IC driver chip, photodiode, and optical elements like lenses and diffractive optical elements, then the module can perform 3D sensing functions, but the module becomes bulky and cannot be integrated into user devices like smartphones
Solution Approach 1:
The patent merges the IC driver chip and VCSEL device onto a single substrate, with both components disposed on opposite surfaces of the same substrate. This integration eliminates the need for separate housing and mounting structures for each component, significantly reducing the overall module volume and enabling integration into compact devices like smartphones.
Solution Approach 2:
The patent utilizes the vertical dimension by disposing the IC driver chip on one surface of the substrate and the VCSEL device on the opposite surface, creating a stacked three-dimensional configuration. This vertical stacking approach reduces the horizontal footprint of the module while maintaining all necessary functional components.
2Ease of operation
If conventional projector modules include multiple optical elements like lenses and diffractive optical elements, then the module can achieve proper light manipulation, but the module size increases and integration into compact devices is restricted
Solution Approach 1:
The patent extracts and eliminates the diffractive optical element from the conventional module configuration. By using a VCSEL device with integrated microlens array and proper substrate positioning, the system achieves the necessary light manipulation functions without requiring the diffractive optical element, thereby reducing module size.
Solution Approach 2:
The patent uses a microlens array integrated into the VCSEL device that replicates the light-collimating function previously requiring separate lenses and diffractive elements. Each microlens corresponds to a VCSEL emitter, creating a direct optical path that eliminates the need for additional optical manipulation components.
3Reliability
If conventional projector modules are designed with multiple components housed separately, then each component can be optimized independently, but the overall module becomes bulky and thermal resistance increases
Solution Approach 1:
The patent merges the IC driver chip and VCSEL device into a single integrated module with shared substrate and housing. This integration improves thermal management by reducing thermal interfaces and allowing the housing to serve as a common heat sink for both components, thereby reducing overall thermal resistance despite maintaining independent component optimization.
Solution Approach 2:
The substrate serves as an intermediary thermal path between the IC driver chip and VCSEL device, providing a direct thermal conduction path that reduces thermal resistance. The substrate material is selected to optimize both electrical isolation and thermal conduction, allowing efficient heat transfer from both components to the housing heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical assembly achieves a smaller footprint and enhanced thermal performance, enabling integration into user devices like smartphones with increased optical power output and reduced thermal resistance.
Implementation Method 1
a microlens component disposed over the plurality of emitters and on a particular surface of the substructure of the VCSEL device
Implementation Method 2
a substrate that includes a thermally conductive core
Data Source
AI summary
In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.