VCSEL Microlens Assembly With Vertical Driver Layout for Thermal Control
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Solution Overview
Problem
Conventional projector modules for 3D sensing applications, such as ToF systems, suffer from increased size and thermal resistance due to the inclusion of an IC driver chip, photodiode, and optical elements, which limits their integration into user devices like smartphones and reduces optical power output.
Innovation Solution
An optical assembly with a VCSEL device disposed vertically over an IC driver chip on a thermally conductive substrate, incorporating a microlens component to collimate light and eliminate the need for additional lenses, and direct thermal conduction through a thermally conductive core to reduce substrate size and improve thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional projector modules include IC driver chip, photodiode, and optical elements, then the system can perform 3D sensing functions, but the size and thermal resistance increase
Solution Approach 1:
The patent merges the IC driver chip and VCSEL device onto a single substrate, with the IC driver chip positioned on a first surface and the VCSEL device on a second surface. This vertical integration consolidates multiple components into one compact module, reducing overall size while maintaining full 3D sensing functionality.
Solution Approach 2:
The patent transitions from a planar arrangement of components to a three-dimensional vertical stack. The IC driver chip and VCSEL device are arranged vertically on opposite surfaces of the substrate, utilizing the Z-dimension to reduce the XY footprint of the module.
2Reliability
If conventional projector modules include IC driver chip, photodiode, and optical elements, then the system can perform 3D sensing functions, but thermal resistance increases
Solution Approach 1:
The patent removes the photodiode component from the module, eliminating the source of thermal resistance associated with photodiode operation. The system achieves 3D sensing functionality through alternative means that do not require the photodiode, thereby reducing thermal resistance while maintaining functional reliability.
3Illumination intensity
If additional lenses are included in the optical assembly, then light collimation can be achieved, but the device size increases
Solution Approach 1:
The patent integrates the microlens array directly with the VCSEL device, forming a unified optical assembly where the microlens array is positioned in close proximity to the VCSEL emitters. This integration eliminates the need for separate additional lenses, achieving light collimation while minimizing device size.
Solution Approach 2:
The microlens array serves as an intermediary optical element that directly couples with the VCSEL device to collimate the emitted light. This intermediary structure enables effective light collimation without requiring larger, separate lens components.
4Length of stationary object
If substrate size is reduced for device integration, then integration into user devices becomes feasible, but thermal management becomes more challenging
Solution Approach 1:
The patent removes the photodiode component, which eliminates associated thermal resistance and heat generation. This extraction allows the substrate to be smaller while improving thermal management, as there are fewer heat-generating components to dissipate.
Solution Approach 2:
The patent combines the IC driver chip and VCSEL device into a single integrated module on a compact substrate. This merging reduces the overall substrate size needed while maintaining efficient thermal pathways through the vertically stacked architecture, improving thermal management despite the reduced substrate area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical assembly achieves reduced size and enhanced thermal conductivity, enabling integration into user devices and increasing optical power output by minimizing thermal resistance and eliminating unnecessary components.
Implementation Method 1
incorporating a microlens component to collimate light
Implementation Method 2
direct thermal conduction through a thermally conductive core to reduce substrate size and improve thermal performance
Data Source
AI summary
In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.