VCSEL Optical Module Self-Alignment Housing Design
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Solution Overview
Problem
Conventional optical transmission modules face challenges in achieving compact size, reducing manufacturing costs, and simplifying the manufacturing process while maintaining high optical alignment efficiency, particularly due to complex alignment processes and the need for additional optical components like lenses and mirrors.
Innovation Solution
The optical transmission module incorporates a vertical cavity surface emitting laser (VCSEL) semiconductor device with a submount and module housing featuring a coupling unit and body, including openings and through holes for self-alignment and self-attachment of the optical cable, eliminating the need for external alignment tools and allowing for precise mechanical alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional optical alignment methods using reflecting mirrors, prisms, and lenses are employed, then optical alignment precision is improved, but manufacturing time increases and manufacturing cost increases
Solution Approach 1:
The patent extracts and removes the complex optical alignment components (reflecting mirrors, prisms, lenses) from the system. Instead of using these separate optical means, the invention integrates the alignment function directly into the semiconductor device structure itself, thereby eliminating the time-consuming manual alignment process while maintaining alignment precision.
Solution Approach 2:
The semiconductor device is designed to perform self-alignment through its inherent structural features. The device automatically achieves proper optical alignment without requiring external alignment tools or manual intervention, thereby reducing manufacturing time and complexity while maintaining precision.
2Manufacturing precision
If conventional optical alignment methods using reflecting mirrors,prisms, and lenses are employed, then optical alignment precision is improved, but device complexity increases
Solution Approach 1:
The patent removes the separate optical alignment components (reflecting mirrors,prisms, lenses) from the system. The alignment function is extracted from being a separate subsystem and integrated into the fundamental structure of the semiconductor device, thereby reducing device complexity.
Solution Approach 2:
The alignment function is merged with the semiconductor device structure itself. Instead of having separate alignment components, the device structure incorporates the alignment capability directly, combining multiple functions into a single integrated component and reducing overall device complexity.
3Manufacturing precision
If conventional optical alignment methods are employed, then optical alignment precision is improved, but the size of the optical transmission module increases
Solution Approach 1:
The patent extracts and eliminates the bulky optical alignment components (reflecting mirrors,prisms, lenses) from the module. By removing these separate components, the overall module size is reduced while the alignment precision is maintained through the integrated self-alignment mechanism.
Solution Approach 2:
The alignment function is nested within the semiconductor device structure itself rather than being implemented as separate external components. This nesting approach allows the alignment mechanism to be compact and integrated, reducing the overall module volume while maintaining alignment precision.
4Manufacturing precision
If conventional optical alignment methods are employed, then optical alignment precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent removes the expensive optical alignment components (reflecting mirrors,prisms, lenses) and their associated manual alignment processes. By extracting these cost-intensive elements and replacing them with a self-aligning device structure, manufacturing cost is reduced while alignment precision is maintained.
Solution Approach 2:
The device performs self-alignment automatically without requiring expensive external alignment tools or skilled manual intervention. This self-service capability eliminates the need for costly alignment equipment and reduces manufacturing complexity, thereby lowering overall manufacturing cost while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact, cost-effective, and simplified manufacturing process with improved optical alignment and coupling efficiency, facilitating self-alignment between the semiconductor light emitting device and the optical cable, thereby reducing production time and increasing productivity.
Implementation Method 1
a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a first surface of the submount
Data Source
AI summary
Embodiments relate to a semiconductor device, an optical transmission module, and an optical transmission apparatus. An optical transmission module according to an embodiment includes a board; a submount disposed on a first surface of the board; a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a first surface of the submount; and a module housing including a coupling unit and a body, the coupling unit spaced apart from the vertical cavity surface emitting laser (VCSEL) semiconductor device and facing the first surface of the submount, the body extending from the coupling unit toward the first surface of the board and disposed around the submount and the vertical cavity surface emitting laser (VCSEL) semiconductor device.