Chip-Scale VCSEL Package Structure With Integrated Optical Protection
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Solution Overview
Problem
Conventional VCSEL component package structures face challenges in reducing volume, minimizing modular failure risks, and lowering manufacturing costs, while providing effective protection mechanisms.
Innovation Solution
A chip-scale package structure using a wafer-level manufacturing process, featuring a semiconductor chip with conducting structures, a glue layer, a spacer, and an optical component with a conducting layer for electrical connection, which eliminates the need for a photodiode and external circuit, allowing for reduced volume and failure risk, and incorporating a feedback circuit to protect against optical component damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional VCSEL package structure with photodiode and wire bonding is used, then protective function is provided, but package volume is large and manufacturing cost is high
Solution Approach 1:
The patent merges the protective function directly into the VCSEL chip structure by integrating a photodiode layer within the chip itself rather than as a separate component. This integration eliminates the need for external protective components and wire bonding, thereby reducing package volume while maintaining the protective function against laser-induced damage
Solution Approach 2:
The photodiode layer is nested within the VCSEL chip structure, specifically positioned between the laser cavity and the exit aperture. This nested configuration allows the protective function to be embedded within the existing chip architecture without requiring additional external space, thus reducing overall package volume
2Reliability
If a conventional VCSEL package structure with separate photodiode is used, then eye-safety protection is achieved, but device complexity increases
Solution Approach 1:
The patent combines the photodiode protective layer with the VCSEL chip into a single integrated structure, eliminating the need for separate photodiode components, wire bonding connections, and external circuit boards. This merging reduces device complexity while preserving the eye-safety protection function
Solution Approach 2:
The patent extracts the protective function from separate external components and integrates it directly into the VCSEL chip structure. By taking out the need for external photodiodes and wiring, the device complexity is reduced while the protective function remains embedded in the chip
3Reliability
If conventional wire bonding and separate components are used, then electrical connection is established, but manufacturing yield decreases
Solution Approach 1:
The patent merges the electrical connection function into the integrated chip structure, eliminating wire bonding and separate electrical components. This integration reduces the number of manufacturing steps and potential failure points, thereby improving manufacturing yield while maintaining reliable electrical connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the package volume, decreases the risk of modular failure, and lowers manufacturing costs by integrating a protective mechanism within the package structure, enabling efficient electrical connection and optical component condition monitoring.
Implementation Method 1
The optical component 150 includes a micro lens array (MLA) or a diffraction optical element (DOE) whereby a laser beam emitted from the laser chip 110 is converted to a uniform surface light source, array dots light source or irregularly scattered dots light source
Implementation Method 2
the light reflected by the external object is absorbed by the photodiode 220. Therefore, the condition of the optical component 150 can be monitored
Data Source
AI summary
A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.