VCSEL Package Without Wire Bonding
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Solution Overview
Problem
Conventional VCSEL die packages require additional space for wire bonding, leading to a larger form factor and lower assembly yields, which is undesirable for applications needing a minimal form factor.
Innovation Solution
A VCSEL die package that electrically couples to the VCSEL die without wire bonding, using a bottom substrate and submount to form an enclosure with the VCSEL die, allowing for direct electrical contact and thermal management through a thermally conductive pathway.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically contact VCSEL die electrodes, then electrical connection is achieved, but the package form factor increases and assembly yields decrease
Solution Approach 1:
The patent merges the electrical contact function with the package substrate structure itself. The substrate includes contact pads that directly contact the VCSEL die electrodes, eliminating the need for separate wire bonding components. This integration reduces the overall package volume while maintaining reliable electrical connections, directly resolving the contradiction between package size and assembly yield.
Solution Approach 2:
The patent extracts the wire bonding process from the package assembly. By removing the wire bonding step and replacing it with direct contact through substrate pads, the invention eliminates the space requirements and assembly complexity associated with wire bonding, thereby reducing package form factor and improving assembly yields.
2Ease of manufacture
If additional space is allocated for wire bonding components, then electrical connection is achieved, but the package size increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support for the VCSEL die, conducts heat away from the device, and provides electrical contact through integrated pads. This multi-functionality eliminates the need for separate wire bonding components, reducing the package area while maintaining ease of manufacturing through direct contact.
Solution Approach 2:
The electrical contact function is merged into the substrate structure itself. The contact pads are formed as integral parts of the substrate, combining the support and electrical connection functions into a single component, thereby reducing the overall package area required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a smaller form factor and higher assembly yields by eliminating wire bonding, while effectively managing heat and allowing light emission from the VCSEL die package.
Implementation Method 1
The thermally conductive pathway may transfer heat generated from the VCSEL die to a thermal dissipater (e.g. a heat sink or thermal pipe) that dissipates the transferred heat
Implementation Method 2
An aperture is defined in the submount overlapping a light emitting portion of the VCSEL die configured to allow light emitted from the VCSEL die to escape from the VCSEL die package in an outward direction
Data Source
AI summary
A vertical cavity surface emitting laser (VCSEL) die package includes a bottom substrate comprising a bottom contact pad electrically contacting a bottom electrode on a bottom surface of a VCSEL die. The VCSEL die package includes a submount including a submount contact pad electrically contacting a first electrode on another surface of the VCSEL die. The submount contact pad overlaps a portion of the first electrode, wherein the VCSEL die is positioned between the submount and the bottom substrate.