VCSEL Laser Device Shared Cooling Structure
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Solution Overview
Problem
Conventional high-power semiconductor laser treatment devices have complex structures due to separate cooling systems for the skin and laser, leading to increased size and operational difficulty, and the use of edge-emitting lasers is being replaced by VCSELs which require a more efficient packaging and cooling solution.
Innovation Solution
A high-power VCSEL laser treatment device with a shared laser heat sink for both the VCSEL array and skin cooling, utilizing a high thermal conductive optical window sheet, cooling conduction metal piece, and semiconductor chilling plates, along with an optical filling and sealing process to simplify the structure and enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate cooling systems are used for skin cooling and laser heat dissipation, then cooling effectiveness is improved, but device complexity and volume increase
Solution Approach 1:
The patent combines the skin cooling function and laser heat dissipation function into a single integrated cooling system. The semiconductor cooling plate serves dual purposes: its first surface cools the contact window for skin cooling treatment, while its second surface (through the water-through block) dissipates heat from the VCSEL array. This merging eliminates the need for separate cooling systems, reducing device complexity and volume while maintaining effective cooling for both functions.
2Temperature
If separate water through blocks are used for cooling contact window and laser array, then cooling performance is improved, but device volume and operational difficulty increase
Solution Approach 1:
The patent merges two separate water-through blocks into a single integrated water-through block that performs both cooling functions. The first water-through channel cools the contact window, while the second water-through channel cools the VCSEL array, both within one unified structure. This integration simplifies the device, making it easier to operate and reducing volume, while maintaining effective cooling performance for both the skin contact area and the laser source.
3Temperature
If VCSEL array is directly welded on heat dissipation substrate, then heat dissipation efficiency is improved, but waterproofing and sealing become problematic
Solution Approach 1:
The patent introduces a high thermal conductive adhesive layer as an intermediary between the VCSEL array and the heat dissipation substrate. This adhesive layer serves multiple functions: it maintains efficient thermal conduction from the VCSEL array to the substrate, provides waterproof sealing, and ensures mechanical bonding. This intermediary solution resolves the conflict between heat dissipation efficiency and waterproofing, allowing the device to maintain both high thermal performance and reliable sealing in humid or wet environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a simpler, more reliable, and efficient high-power VCSEL laser treatment device with improved heat dissipation and skin cooling, reducing the device's volume and increasing its usability in dermatologic surgery and cosmetology with enhanced waterproof and dustproof capabilities.
Implementation Method 1
heat dissipation is performed on a hot end of the semiconductor chilling plate by means of the VCSEL heat sink
Implementation Method 2
a high thermal conductive optical window sheet disposed on a light emitting opening end of the optical transmission device
Implementation Method 3
high thermal conductive optical window sheet
Implementation Method 4
an integral cooling conduction metal piece is disposed on outer sides of the laser heat sink, the optical transmission device, and the high thermal conductive optical window sheet
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Disclosed is a high power VCSEL (vertical-cavity surface-emitting laser) laser treatment device with a skin cooling function, comprising VCSEL array (4) packaged on a laser heat sink (2), an optical transmission device (8) arranged in front of light-exiting faces of the VCSEL array (4) and a high-heat-conductivity optical window sheet (6) adhered to the light-exiting port end of the optical transmission device (8). An integrally molded cooling conduction metal piece (1) is arranged on the outer sides of the laser heat sink (2), the optical transmission device (8) and the high-heat-conductivity optical window sheet (6). In addition, one or more semiconductor chilling plates (7) are arranged between the cooling conduction metal piece (1) and the laser heat sink (2), wherein the hot ends of the semiconductor chilling plates (7) are in contact with the laser heat sink (2) and the cold ends of the semiconductor chilling plates (7) are in contact with the cooling conduction metal piece (1). In the above-mentioned high power VCSEL semiconductor laser treatment device, the semiconductor chilling plates (7) and the VCSEL array (4) share the heat sink, so that the inner structure is simplified. Therefore, the laser treatment device has the advantages of being simple in structure, powerful in function, easy to manufacture, high in reliability and the like, thus having broad application prospects in the field of laser medicine.