VCSEL Laser Substrate Heating With Cooled IR Plate Uniformity
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Solution Overview
Problem
Current substrate heat-treating apparatuses face challenges in achieving temperature uniformity during heat treatment processes due to limitations in maintaining constant emissivity and reducing temperature deviations.
Innovation Solution
The apparatus incorporates a process chamber with a beam irradiating plate and an infrared transmitting plate made of transparent quartz, along with a gas circulation cooling module that sprays cooling gas onto the infrared transmitting plate to maintain temperature uniformity and reduce emissivity, utilizing a VCSEL device for uniform laser beam irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a laser beam is irradiated to heat a substrate, then the heating efficiency is improved, but temperature deviation increases and temperature uniformity deteriorates
Solution Approach 1:
The patent divides the single laser beam into multiple sub-beams by segmenting the laser source into multiple VCSEL elements arranged in an array. Each VCSEL element emits a laser beam that is individually controlled and directed at different regions of the substrate, allowing distributed heating that improves temperature uniformity while maintaining high heating efficiency through the cumulative effect of multiple beams.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces temperature deviations and enhances temperature uniformity across the substrate, preventing emissivity increases and minimizing process gas deposition, thereby improving the efficiency of heat treatment processes.
Implementation Method 1
a beam irradiating module for irradiating a laser beam to a lower surface of the flat substrate
Implementation Method 2
irradiating a laser beam to a lower surface of the flat substrate through the beam irradiating plate
Implementation Method 3
a gas circulation cooling module for spraying a cooling gas to an upper surface of the infrared transmitting plate, thereby cooling the infrared transmitting plate
Implementation Method 4
an infrared transmitting plate placed above the flat substrate
Data Source
AI summary
The present disclosure provides substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam irradiating plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a laser beam to a lower surface of the flat substrate through the beam irradiating plate; and a gas circulation cooling module for spraying a cooling gas to an upper surface of the infrared transmitting plate, thereby cooling the infrared transmitting plate.

