VCSEL Contact Surface Planarization for Uniform Light Emission
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Solution Overview
Problem
The uniformity of light emitted from optoelectronic devices based on cavity resonators is poor due to varying wavelengths at different positions, which affects the performance of GaN-based vertical cavity surface emitting lasers.
Innovation Solution
A manufacturing method for vertical cavity surface emitting lasers involves sequentially stacking a first reflector, a first semiconductor layer, an active layer, a second semiconductor layer, an oxide layer, and a second reflector, with planarization of contact surfaces to ensure uniformity, including the formation of a light transmitting and light shielding region in the oxide layer to control light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods are used for vertical cavity surface emitting lasers, then the device can be manufactured, but the uniformity of light emission is poor due to varying wavelengths at different positions
Solution Approach 1:
The patent applies preliminary action by planarizing the contact surfaces between semiconductor layers and reflectors before assembling the vertical cavity structure. This pre-planarization ensures uniform cavity length and thickness of epitaxial layers, which directly improves the uniformity of light emission wavelength across different positions of the laser device.
Solution Approach 2:
The patent changes the surface topology parameter of the contact interfaces by planarizing them. This parameter change from non-planar to planar surfaces ensures uniform optical path length and cavity thickness, thereby improving the spectral uniformity and light emission consistency of the VCSEL device.
2Manufacturing precision
If planarization is performed on contact surfaces to improve light uniformity, then emission uniformity improves, but manufacturing complexity increases
Solution Approach 1:
The planarization step is performed as a preliminary action during the manufacturing process, specifically on the contact surfaces between semiconductor layers and reflectors. This early intervention ensures that subsequent assembly steps produce uniform cavity structures without requiring complex post-processing or adjustment mechanisms.
3Measurement precision
If the cavity length and epitaxial layer thickness are made consistent through planarization, then light wavelength specificity improves, but manufacturing steps increase
Solution Approach 1:
The patent performs planarization as a preliminary manufacturing step to establish uniform contact surfaces before depositing epitaxial layers and assembling the cavity structure. This preliminary action ensures that the cavity length and layer thickness remain consistent throughout production, improving wavelength specificity without requiring complex real-time monitoring or adjustment systems.
Data Source
AI summary
A manufacturing method of a vertical cavity surface emitting laser is provided. The vertical cavity surface emitting laser includes a first reflector, a first semiconductor layer, an active layer, a second semiconductor layer, an oxide layer, and a second reflector sequentially stacked. The conductivity type of the first semiconductor layer is opposite to that of the second semiconductor layer. The oxide layer includes a light transmitting region and a light shielding region, and the light shielding region surrounds the light transmitting region. The manufacturing method includes planarizing a first contact surface of the first semiconductor layer and the first reflector, and/or a second contact surface of the second semiconductor layer and the second reflector.